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Lecture Notes in Mechanical Engineering; Intelligent Manufacturing and Mechatronics ,
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Response Surface Optimization of the Radial Heat Sink Param..:
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Lecture Notes in Mechanical Engineering; Intelligent Manufacturing and Mechatronics ,
2
An Innovative Anti-theft System for Automotive:
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2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) ,
3
Development of Flip-Chip Packaging for Monolithic Microwave..:
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2020 IEEE 70th Electronic Components and Technology Conference (ECTC) ,
4
Fine-Pitch RDL Integration for Fan-Out Wafer-Level Packagin:
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2020 IEEE 70th Electronic Components and Technology Conference (ECTC) ,
5
Demonstration of Vertically Integrated POP using FOWLP Appr..:
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Advances in Science, Technology & Innovation; Advancing Smart Cities ,
6
Design and Characterization of Compact On-Metal UHF RFID Ta..:
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2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ,
7
A Compact Wafer-Level Heterogeneously Integrated Scalable O..:
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2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ,
8
A Heterogeneously Integrated Wafer-level Processed Co-Packa..:
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2019 IEEE 21st Electronics Packaging Technology Conference (EPTC) ,
9
Silicon Optical Electrical Interposer - Fiber to the Chip:
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2018 IEEE EMBS International Conference on Biomedical & Health Informatics (BHI) ,
10
Development and implementation of nationwide predictive mod..:
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Proceedings of the first ACM conference on Wireless network security ,
11
Identifying unique devices through wireless fingerprinting:
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2023 13th International Conference on Information Technology in Asia (CITA) ,
12
A Song Classifier for Predicting User Preference Based on S..:
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