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Lim, Boon Han
155  Ergebnisse:
Buchkapitel (Online) X
Personensuche X
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1

Investigation of Bifacial Gain and Albedo of Bifacial Photo..:

, In: 2024 8th International Conference on Green Energy and Applications (ICGEA),
Tan, Hui Li ; Lim, Boon Han ; Tan, Ming Hui... - p. 265-270 , 2024
Link: https://doi.org/10.1109/..
 
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2

EFX Under Budget Constraint:

, In: Frontiers of Algorithmic Wisdom; Lecture Notes in Computer Science,
Dai, Sijia ; Gao, Guichen ; Liu, Shengxin... - p. 3-14 , 2022
Link: https://doi.org/10.1007/..
 
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3

Battery Lifetime And Life Cycle Cost Analysis Of Battery-Su..:

, In: 2022 IEEE 5th International Symposium in Robotics and Manufacturing Automation (ROMA),
Lim, Kai Jie ; Chong, Lee Wai ; Morris, Stella... - p. 1-6 , 2022
Link: https://doi.org/10.1109/..
 
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4

Comparative Study for Time-specific Ross Coefficient and Ov..:

, In: 2019 IEEE Conference on Sustainable Utilization and Development in Engineering and Technologies (CSUDET),
Lai, Keen-Yip ; Lim, Boon-Han - p. 251-256 , 2019
Link: https://doi.org/10.1109/..
 
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5

Stand-alone Solar Photovoltaic System and Its Application i..:

, In: 2019 IEEE Conference on Sustainable Utilization and Development in Engineering and Technologies (CSUDET),
Chong, Kok-Keong ; Chian, Lee Kong ; Lee, Kok-Yik... - p. 188-193 , 2019
Link: https://doi.org/10.1109/..
 
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6

Constructing 3-Dimentional (3D) Model Using Light Detection..:

, In: Lecture Notes in Electrical Engineering; Control, Instrumentation and Mechatronics: Theory and Practice,
Minn, Tay Han ; Wei, Chua Ming ; Boon, Lim Eu.. - p. 34-43 , 2022
Link: https://doi.org/10.1007/..
 
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7

Board Level Solder Joint Reliability Design and Analysis of..:

, In: 2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC),
Zhang, Xiaowu ; Lau, Boon Long ; Chen, Haoran... - p. 316-320 , 2020
Link: https://doi.org/10.1109/..
 
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8

Comprehensive Design and Analysis of Fan-Out Wafer Level Pa..:

, In: 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC),
Zhang, Xiaowu ; Andriani, Yosephine ; Jong, Ming Chinq... - p. 107-110 , 2019
Link: https://doi.org/10.1109/..
 
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9

Numerical and Experimental Investigation of Package Warpage..:

, In: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC),
Zhang, Xiaowu ; Lim, Sharon Pei Siang ; Lau, Boon Long... - p. 734-737 , 2023
Link: https://doi.org/10.1109/..
 
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10

Development of Si-Based Micro-Fluidic Cooler for Thermal Ma..:

, In: 2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm),
Han, Yong ; Lau, Boon Long ; Tang, Gongyue... - p. 976-981 , 2019
Link: https://doi.org/10.1109/..
 
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11

Investigation of Liquid Cooling for Data Center Server Base..:

, In: 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC),
Han, Yong ; Lau, Boon Long ; Tang, Gongyue... - p. 62-65 , 2019
Link: https://doi.org/10.1109/..
 
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12

Parameters Optimization of Quantization Schemes for Channel..:

, In: GLOBECOM 2023 - 2023 IEEE Global Communications Conference,
Wang, Yuhong ; Sun, Sumei ; Huang, Min Li... - p. 5986-5991 , 2023
Link: https://doi.org/10.1109/..
 
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13

Intrapartum care for obese and morbidly obese women:

, In: Obesity and Obstetrics,
Edwards, Lindsay ; Lim, Boon H. - p. 207-218 , 2020
Link: https://doi.org/10.1016/..
 
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14

List of contributors:

, In: Obesity and Obstetrics,
Al Beloushi, Mariam ; Anderson, Annie S. ; Arulkumaran, Sabaratnam... - p. xv-xvii , 2020
Link: https://doi.org/10.1016/..
 
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15

Perfect molding challenges and the limitations:

, In: 2017 IEEE 19th Electronics Packaging Technology Conference (EPTC),
Tan, Lay Tatt ; Teo, Yin Yin ; Lee, Chee Hong. - p. 1-6 , 2017
Link: https://doi.org/10.1109/..
 
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