Lim, W. S.
668  Ergebnisse:
Personensuche X
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1

Device Design and Reliability of GAA MBCFET:

, In: 2024 IEEE International Reliability Physics Symposium (IRPS),
Kang, M. ; Chang, M. ; Park, Y.... - p. 1-6 , 2024
 
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2

Highly Reliable and Manufacturable MRAM embedded in 14nm Fi..:

, In: 2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits),
Ko, S. ; Park, J. H. ; Bak, J. H.... - p. 1-2 , 2023
 
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3

Novel Heat Dissipating Cell Scheme for Improving a Reset Di..:

, In: 2007 IEEE Symposium on VLSI Technology,
Kang, D.H. ; Yu, J. ; Kong, J.H.... - p. None , 2007
 
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4

Highly Reliable 256Mb PRAM with Advanced Ring Contact Techn..:

, In: 2006 Symposium on VLSI Technology, 2006. Digest of Technical Papers.,
Song, Y.J. ; Kong, J. ; Ahn, S.... - p. 118-119 , 2006
 
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5

Comprehensive study on prediction of endurance properties f..:

, In: 2023 IEEE International Reliability Physics Symposium (IRPS),
Sato, H. ; Shin, H. M. ; Jung, H.... - p. 1-5 , 2023
 
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6

Advanced System in Package Enabled by Wafer Level Heterogen..:

, In: 2022 International Electron Devices Meeting (IEDM),
Bhattacharya, S. ; Lim, T. G. ; Ho, D.... - p. 3.1.1-3.1.4 , 2022
 
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7

28nm CIS-Compatible Embedded STT-MRAM for Frame Buffer Memo..:

, In: 2021 IEEE International Electron Devices Meeting (IEDM),
Lee, K. ; Kim, D. S. ; Bak, J. H.... - p. 2.1.1-2.1.4 , 2021
 
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8

A novel integration of STT-MRAM for on-chip hybrid memory b..:

, In: 2019 IEEE International Electron Devices Meeting (IEDM),
Park, J.-H. ; Lee, J. ; Jeong, J.... - p. 2.5.1-2.5.4 , 2019
 
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9

From Technical Analysis to Text Analytics: Stock and Index ..:

, In: 2019 IEEE International Conference on Cybernetics and Intelligent Systems (CIS) and IEEE Conference on Robotics, Automation and Mechatronics (RAM),
Teoh, T.-T. ; Lim, W. T. ; Koh, K. W.... - p. 496-500 , 2019
 
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10

A Korean Character Recognition System:

, In: TENCON '91. Region 10 International Conference on EC3-Energy, Computer, Communication and Control Systems,
Choi, J.G. ; Cheong, C.E. ; Roh, H.H.... - p. 242,243,244,245,246 , 1991
 
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11

Use of Modular Femoral Stem combined with large Diameter Fe..:

, In: Ceramics in Orthopaedics; Bioceramics and Alternative Bearings in Joint Arthroplasty,
 
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12

Metal Ion Hypersensitivity in Metal-on-Metal Hip Arthroplas..:

, In: Ceramics in Orthopaedics; Bioceramics and Alternative Bearings in Joint Arthroplasty,
 
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13

Application of Sensor Technology for Energy Consumption Ana..:

, In: 2023 IEEE International Conference on Industrial Engineering and Engineering Management (IEEM),
Tee, B.T. ; Lim, S.C.J. ; Siew, P.W.. - p. 0913-0917 , 2023
 
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14

A 16-channel Active-Matrix Mini-LED Driver with an USI-B fo..:

, In: 2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits),
Kwon, Y. ; Kwak, Y. ; Choi, Y.... - p. 1-2 , 2023
 
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