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Lin, Chin-Min
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1

Intelligent Agent Assisted Handover in WLAN and Cellular Ne..:

, In: Proceedings of the 2006 IEEE/WIC/ACM international conference on Web Intelligence and Intelligent Agent Technology,
Chou, Li-Der ; Lai, Wei-Cheng ; Lin, Chen-Han.. - p. 243-247 , 2006
Link: https://dl.acm.org/doi/1..
 
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2

DC-to-135 GHz and 15-to-135 GHz SPDT traveling wave switche..:

, In: IEEE MTT-S International Microwave Symposium Digest, 2005.,
Zuo-Min Tsai ; Mei-Chao Yeh ; Ming-Fong Lei... - p. None , 2005
Link: https://doi.org/10.1109/..
 
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3

SpotLight: A Hotspot-Greedy, Light-Weighted, and Automated ..:

, In: 2024 25th International Symposium on Quality Electronic Design (ISQED),
Wu, Chin-Wei ; Lee, Yu-Min ; Huang, Pei-Yu... - p. 1-8 , 2024
Link: https://doi.org/10.1109/..
 
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4

Low-Temperature Nanocrystalline Cu/polymer Hybrid Bonding w..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Lee, Ou-Hsiang ; Chiu, Wei-Lan ; Chang, Hsiang-Hung... - p. 1863-1867 , 2024
Link: https://doi.org/10.1109/..
 
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5

Advanced Chip on Wafer Hybrid Bonding with Copper/Polymer B..:

, In: 2024 International VLSI Symposium on Technology, Systems and Applications (VLSI TSA),
Ouyang, Tsung- Yu ; Lin, Yu-Min ; Chan, Yu-Ping... - p. 1-2 , 2024
Link: https://doi.org/10.1109/..
 
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6

An Electromigration Study of Cu Pillar Interconnects in Fli..:

, In: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC),
Tsai, Min-Yan ; Kao, Chin-Li ; Wang, Shan-Bo... - p. 326-332 , 2023
Link: https://doi.org/10.1109/..
 
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7

Demonstration of A 3D Chip by Logic-DRAM Stacked Using Pair..:

, In: 2023 International VLSI Symposium on Technology, Systems and Applications (VLSI-TSA/VLSI-DAT),
Lu, Chun-Lin ; Chen, Chun Cheng ; Lin, Sheng-Chieh... - p. 1-2 , 2023
Link: https://doi.org/10.1109/..
 
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8

Machine Learning Approach to IoT- Based Water Quality Monit..:

, In: 2023 IEEE 5th Eurasia Conference on Biomedical Engineering, Healthcare and Sustainability (ECBIOS),
Chang, Chin-Chih ; Wei, Chi-Hung ; Lin, Min-Tien. - p. 182-186 , 2023
Link: https://doi.org/10.1109/..
 
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9

7.1 A 3.4-to-13.3TOPS/W 3.6TOPS Dual-Core Deep-Learning Acc..:

, In: 2020 IEEE International Solid- State Circuits Conference - (ISSCC),
Lin, Chien-Hung ; Cheng, Chih-Chung ; Tsai, Yi-Min... - p. 134-136 , 2020
Link: https://doi.org/10.1109/..
 
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10

Improving Deep Learning by Incorporating Semi-automatic Mov..:

, In: 2019 IEEE International Conference on Systems, Man and Cybernetics (SMC),
Feng, Ri-Chen ; Lin, Daw-Tung ; Chen, Ken-Min.. - p. 2484-2489 , 2019
Link: https://doi.org/10.1109/..
 
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11

18.6 A 0.5nJ/pixel 4K H.265/HEVC codec LSI for multi-format..:

, In: 2015 IEEE International Solid-State Circuits Conference - (ISSCC) Digest of Technical Papers,
Ju, Chi-Cheng ; Liu, Tsu-Ming ; Lee, Kun-Bin... - p. 1-3 , 2015
Link: https://doi.org/10.1109/..
 
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12

Contributors:

, In: Quantification of Brain Function Using PET,
Adam, M. ; Alpert, Nathaniel M. ; Anderson, J.R.... - p. xvii-xxvi , 1996
Link: https://doi.org/10.1016/..
 
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13

Assessing ductility behavior in beam web openings featuring..:

, In: International Conference on Innovation, Communication and Engineering (ICICE 2023),
Lin, Keng-Ta ; Wu, Min-Hao ; Chen, Li-Chin - p. None , 2023
Link: https://doi.org/10.1049/..
 
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14

Improving Edge Dead Domain and Endurance in Scaled HfZrOx F..:

, In: 2021 IEEE International Electron Devices Meeting (IEDM),
Lin, Yu-De ; Yeh, Po-Chun ; Tang, Ying-Tsan... - p. 6.4.1-6.4.4 , 2021
Link: https://doi.org/10.1109/..
 
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15

NTIRE 2020 Challenge on NonHomogeneous Dehazing:

, In: 2020 IEEE/CVF Conference on Computer Vision and Pattern Recognition Workshops (CVPRW),
Ancuti, Codruta O. ; Ancuti, Cosmin ; Vasluianu, Florin-Alexandru... - p. 2029-2044 , 2020
Link: https://doi.org/10.1109/..
 
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