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Proceedings of the 2011 ACM Symposium on Applied Computing ,
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A pattern-based verification approach for a multi-core syst..:
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2022 International Symposium on VLSI Technology, Systems and Applications (VLSI-TSA) ,
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Si Metal-Oxide-Semiconductor and Si/SiGe Heterostructure Qu..:
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Communications in Computer and Information Science; Technologies and Applications of Artificial Intelligence ,
3
Context Enhanced Recurrent Neural Network for Session-Aware..:
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2021 IEEE International Electron Devices Meeting (IEDM) ,
4
Ge Single-Crystal-Island (Ge-SCI) Technique and BEOL Ge Fin..:
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2019 IEEE International Electron Devices Meeting (IEDM) ,
5
Monolithic 3D SRAM-CIM Macro Fabricated with BEOL Gate-All-..:
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Proceedings of the 24th Annual International Conference on Mobile Computing and Networking ,
6
Service Level Virtualization (SLV) : A Preliminary Imple..:
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2021 International Symposium on VLSI Design, Automation and Test (VLSI-DAT) ,
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Chip Performance Prediction Using Machine Learning Techniqu..:
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2023 9th International Conference on Applied System Innovation (ICASI) ,
8
A Research Structure of Big Data Analysis and Application f..:
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Neural Information Processing; Lecture Notes in Computer Science ,
9
Glomerulus Detection on Light Microscopic Images of Renal P..:
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Proceedings of the 51st Annual Design Automation Conference ,
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Contactless Stacked-die Testing for Pre-bond Interposers:
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Proceedings of the conference on Design, Automation & Test in Europe ,
11
Package geometric aware thermal analysis by infrared-radiat..:
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2014 Design, Automation & Test in Europe Conference & Exhibition (DATE) ,
12
Package geometric aware thermal analysis by infrared-radiat..:
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2007 IEEE International Symposium on Circuits and Systems (ISCAS) ,
13
Complexity Reduction of H.263 to H.264 Transcoder with Fast..:
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2024 IEEE/MTT-S International Microwave Symposium - IMS 2024 ,
14
235-GHz Amplifier-Frequency-Multiplier Chain with Optimal H..:
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2023 International Conference on Artificial Intelligence in Information and Communication (ICAIIC) ,
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