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Lin, Mei-Na
489  Ergebnisse:
Buchkapitel (Online) X
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1

Channel Assignment Algorithm Based on Discrete BFO for Wire..:

, In: Intelligent Computing Theories and Application; Lecture Notes in Computer Science,
Xia, Na ; Luo, Lin-Mei ; Du, Hua-Zheng... - p. 707-724 , 2021
Link: https://doi.org/10.1007/..
 
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2

Study on ELK Dielectric Reliability During the Solder Reflo..:

, In: 2024 Conference of Science and Technology for Integrated Circuits (CSTIC),
Zheng, Jialin ; Zhao, Yunong ; Wang, Zhuqiu... - p. 1-4 , 2024
Link: https://doi.org/10.1109/..
 
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3

Study on Failure Mechanism of C4 Bump Solder Excursion in C..:

, In: 2024 Conference of Science and Technology for Integrated Circuits (CSTIC),
Wei, Xixiong ; Lin, Xinyi ; Zhou, Shilu.. - p. 1-3 , 2024
Link: https://doi.org/10.1109/..
 
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4

Investigation on the Root Cause of ESD Failure of Large Siz..:

, In: 2024 Conference of Science and Technology for Integrated Circuits (CSTIC),
Zhang, Yunhe ; Lin, Shaobing ; Chao, Shuanshe... - p. 1-3 , 2024
Link: https://doi.org/10.1109/..
 
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5

A New High-efficient Burn-in Screening Methodology Applied ..:

, In: 2023 24th International Conference on Electronic Packaging Technology (ICEPT),
Sheng, Yalan ; Gao, Yining ; Sun, Niuyi... - p. 1-4 , 2023
Link: https://doi.org/10.1109/..
 
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6

Research on the Functional Failure of Large Scale Chips Cau..:

, In: 2023 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA),
Chao, Shuanshe ; Lin, Xinyi ; Wei, Xixiong... - p. 1-5 , 2023
Link: https://doi.org/10.1109/..
 
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7

Failure Analysis for IIH leakage on 7nm FinFFT Technology C..:

, In: 2023 24th International Conference on Electronic Packaging Technology (ICEPT),
Chao, Shuanshe ; Lin, Xinyi ; Dong, Chen... - p. 1-4 , 2023
Link: https://doi.org/10.1109/..
 
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8

Correlation Analysis between Warpage and Metal Thermal Inte..:

, In: 2023 24th International Conference on Electronic Packaging Technology (ICEPT),
Wu, Zhuolun ; Wang, Zhuqiu ; Qi, Di... - p. 1-4 , 2023
Link: https://doi.org/10.1109/..
 
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9

Organic Thermal Interface Materials Delamination Analysis o..:

, In: 2023 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA),
Wu, Zhuolun ; Wei, Xixiong ; Wang, Zhuqiu... - p. 1-6 , 2023
Link: https://doi.org/10.1109/..
 
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10

Study on Stress Migration of FCQFN Package with Unbalanced ..:

, In: 2022 China Semiconductor Technology International Conference (CSTIC),
Chao, Shuanshe ; Lin, Xinyi ; Yang, Dan... - p. 1-4 , 2022
Link: https://doi.org/10.1109/..
 
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11

Fault Localization of Functional Failure by using Dynamic E..:

, In: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT),
Ouyang, Keqing ; Wei, Xixiong ; Lin, Xinyi... - p. 1-3 , 2022
Link: https://doi.org/10.1109/..
 
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12

Measurement Process Optimization in Using Lock-in Thermogra..:

, In: 2021 22nd International Conference on Electronic Packaging Technology (ICEPT),
Chao, Shuanshe ; Mei, Na ; Lin, Xinyi... - p. 1-4 , 2021
Link: https://doi.org/10.1109/..
 
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13

List of contributors:

, In: Privileged Scaffolds in Drug Discovery,
Alam, Mohammad Abrar ; Cao, Jin-Xu ; Cao, Peng... - p. xvii-xxii , 2023
Link: https://doi.org/10.1016/..
 
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14

Seepage Field Adjustment for Enhanced Oil Recovery in High ..:

, In: Springer Series in Geomechanics and Geoengineering; Proceedings of the International Field Exploration and Development Conference 2023,
He, Shu-mei ; Wei, Peng-peng ; Ma, Zi-lin... - p. 447-460 , 2024
Link: https://doi.org/10.1007/..
 
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15

List of Contributors:

, In: Recent Advances in Cancer Research and Therapy,
Cai, Ying ; Cao, Xin ; Chao, Chi-Hong... - p. xix-xxvi , 2012
Link: https://doi.org/10.1016/..
 
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