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Lin, Yung-I
692  Ergebnisse:
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1

Patch-type Flex SiP Platform for Heathcare Application:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Chen, Ming-Hung ; Chang, Wei-Hao ; Jian, Hui-Ping... - p. 1438-1441 , 2023
Link: https://doi.org/10.1109/..
 
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2

Molecular Mimicry between SARS Coronavirus Spike Protein an..:

, In: 2007 Frontiers in the Convergence of Bioscience and Information Technologies,
Hwa, Kuo-Yuan ; Lin, Wan Man ; Hou, Yung-I. - p. None , 2007
Link: https://doi.org/10.1109/..
 
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3

Reinforcement Learning Control for Six-Phase Permanent Magn..:

, In: 202020 3rd IEEE International Conference on Knowledge Innovation and Invention (ICKII),
Peng, Wei-Lun ; Lan, Yung-Wen ; Chen, Shih-Gang... - p. 332-335 , 2020
Link: https://doi.org/10.1109/..
 
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4

Contributors:

, In: Tea in Health and Disease Prevention,
Abbas, Sami ; AbouLaila, Mahmoud ; Acquas, Elio... - p. xvii-xxxviii , 2013
Link: https://doi.org/10.1016/..
 
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5

A CMOS low dropout regulator stable with any load capacitor:

, In: 2004 IEEE Region 10 Conference TENCON 2004.,
Hsuan-I Pan ; Chin-Hung Cheng ; Chern-Lin Chen. - p. 266,267,268,269 , 2004
Link: https://doi.org/10.1109/..
 
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6

A 22nm 96KX144 RRAM Macro with a Self-Tracking Reference an..:

, In: 2020 IEEE Symposium on VLSI Circuits,
Chou, Chung-Cheng ; Lin, Zheng-Jun ; Lai, Chien-An... - p. 1-2 , 2020
Link: https://doi.org/10.1109/..
 
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7

List of Contributors:

, In: Interventional Spine,
Abbasi, Arjang ; Abdel-Moty, Elsayed ; Abdi, Salahadin... - p. ix-xv , 2008
Link: https://doi.org/10.1016/..
 
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8

Void Migration Kinetics in Fine Line Cu RDL under Electric ..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Huang, Yen-Cheng ; Tsai, Min-Yan ; Lin, Ting-Chun... - p. 576-580 , 2024
Link: https://doi.org/10.1109/..
 
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9

A Study on the Surface Activation of Plasma Treatment for H..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Hsu, Chih-Jing ; Fang, Hsu-Nan ; Su, Tzu-Yu... - p. 1826-1829 , 2024
Link: https://doi.org/10.1109/..
 
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10

Direct Observation of Void Nucleation and Growth in a 2-µm-..:

, In: 2024 International Conference on Electronics Packaging (ICEP),
Liang, Chien-Lung ; Lin, Yung-Sheng ; Tsai, Min-Yan... - p. 1-2 , 2024
Link: https://doi.org/10.23919..
 
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11

A novel and simple method of low temperature, low process t..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Huang, Jeng-Hau ; Shih, Po-Shao ; Shen, Chang-Hsien... - p. 1660-1663 , 2023
Link: https://doi.org/10.1109/..
 
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12

An Electromigration Study of Cu Pillar Interconnects in Fli..:

, In: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC),
Tsai, Min-Yan ; Kao, Chin-Li ; Wang, Shan-Bo... - p. 326-332 , 2023
Link: https://doi.org/10.1109/..
 
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13

Flexible Hybrid Electronics on Wearable Healthcare Applicat..:

, In: 2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC),
Chen, Ming-Hung ; Chang, Wei-Hao ; Pi, Tun-Ching... - p. 1-5 , 2023
Link: https://doi.org/10.23919..
 
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14

Low-Temperature and Pressureless Cu-to-Cu Bonding by Electr..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Shih, Po-Shao ; Huang, Jeng-Hau ; Shen, Chang-Hsien... - p. 579-584 , 2023
Link: https://doi.org/10.1109/..
 
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15

Visualization of Heart Rate Abnormality and Its Application..:

, In: 2023 IEEE International Symposium on Medical Measurements and Applications (MeMeA),
Lu, Yen-Tzu ; Chang, Wen-Yen ; Lan, Kun-Chan. - p. 1-6 , 2023
Link: https://doi.org/10.1109/..
 
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