Lo, Hui-Chen
400  Ergebnisse:
Personensuche X
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1

15.4 A 22nm 2Mb ReRAM Compute-in-Memory Macro with 121-28TO..:

, In: 2020 IEEE International Solid- State Circuits Conference - (ISSCC),
Xue, Cheng-Xin ; Huang, Tsung-Yuan ; Liu, Je-Syu... - p. 244-246 , 2020
 
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2

Effects of Channel Thickness on DC/RF Performance of InAlGa..:

, In: 2024 International VLSI Symposium on Technology, Systems and Applications (VLSI TSA),
Shieh, De ; Lee, Zheng-Fong ; Lee, Ming-Yuan... - p. 1-2 , 2024
 
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3

U-MRAM PUF: A Novel Unipolar-MRAM for Power and Area Effici..:

, In: 2024 International VLSI Symposium on Technology, Systems and Applications (VLSI TSA),
Shih, Ching ; Hong, Ming-Chun ; Wang, Chih-Yao... - p. 1-2 , 2024
 
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4

Design of High-RA STT-MRAM for Future Energy-Efficient In-M..:

, In: 2023 International VLSI Symposium on Technology, Systems and Applications (VLSI-TSA/VLSI-DAT),
Hong, Ming-Chun ; Su, Yi-Hui ; Chen, Guan-Long... - p. 1-2 , 2023
 
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5

U-MRAM: Transistor-Less, High-Speed (10 ns), Low-Voltage (0..:

, In: 2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits),
Wu, Ming-Hung ; Hong, Ming-Chun ; Shih, Ching... - p. 1-2 , 2023
 
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6

Turning MIMS from a Curse into a Blessing: Tripartite Partn..:

, In: Mobile Communication in Asia: Local Insights, Global Implications; Mobile Communication and Online Falsehoods in Asia,
Hung, Chen-Ling ; Lo, Shih-Hung ; Hu, Yuan-Hui - p. 305-320 , 2023
 
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7

Structure and Performance Co-optimization for the Developme..:

, In: 2023 International VLSI Symposium on Technology, Systems and Applications (VLSI-TSA/VLSI-DAT),
 
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8

Contributors:

, In: Medicinal Usage of Cannabis and Cannabinoids,
 
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9

GaN on Si RF performance with different AlGaN back barrier:

, In: 2023 International VLSI Symposium on Technology, Systems and Applications (VLSI-TSA/VLSI-DAT),
Hsieh, Chang-Yan ; Chen, Hui-Yu ; Tu, Po-Tsung... - p. 1-2 , 2023
 
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10

A 4K–400K Wide Operating-Temperature-Range MRAM Technology ..:

, In: 2022 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits),
Hong, Ming-Chun ; Chang, Yao-Jen ; Hsin, Yu-Chen... - p. 379-380 , 2022
 
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11

Highly Reliable, Scalable, and High-Yield HfZrOx FRAM by Ba..:

, In: 2022 International Electron Devices Meeting (IEDM),
Lin, Yu-De ; Yeh, Po-Chun ; Dai, Jheng-Yang... - p. 32.1.1-32.1.4 , 2022
 
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12

The thermal stability improvement of spin-orbit-torque (SOT..:

, In: 2022 International Symposium on VLSI Technology, Systems and Applications (VLSI-TSA),
 
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13

In-Memory Annealing Unit (IMAU): Energy-Efficient (2000 TOP..:

, In: 2021 IEEE International Electron Devices Meeting (IEDM),
Hong, Ming-Chun ; Cho, Le-Chih ; Lin, Chih-Sheng... - p. 21.3.1-21.3.4 , 2021
 
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14

Low-environmental-interference & highly-sensitive TMR biose..:

, In: 2020 International Symposium on VLSI Technology, Systems and Applications (VLSI-TSA),
Kuo, Yi-Ching ; Lee, Hsin-Han ; Wang, Ding-Yeong... - p. 56-57 , 2020
 
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15

Fabrication and device characterization of large linear dyn..:

, In: 2020 International Symposium on VLSI Technology, Systems and Applications (VLSI-TSA),
Chen, Fang-Ming ; Wang, I-Jung ; Wang, Ding-Yeong... - p. 104-105 , 2020
 
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