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Lo, Po-Wei
321  Ergebnisse:
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1

Generic Stacked BMS Using Low-side MOSFET Control Architect..:

, In: 2023 International Conference on Consumer Electronics - Taiwan (ICCE-Taiwan),
Chen, Lo-Tung ; Teo, J. C. ; Yang, Xiang-Jun... - p. 181-182 , 2023
Link: https://doi.org/10.1109/..
 
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2

An Integrated Circuit of A Cold Start-up Circuit for A Ther..:

, In: 2023 IEEE International Symposium on Circuits and Systems (ISCAS),
Yu, Xin-Hao ; Lin, Po-Wei ; Hsu, Cheng-Yang... - p. 1-4 , 2023
Link: https://doi.org/10.1109/..
 
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3

An Ambient Energy Harvesting Interface for Battery-Free Wir..:

, In: 2024 IEEE Wireless Power Technology Conference and Expo (WPTCE),
Liu, Chi-Wei ; Huang, Cong-Sheng ; Lo, Wen-Po. - p. 459-462 , 2024
Link: https://doi.org/10.1109/..
 
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4

Advanced Chip on Wafer Hybrid Bonding with Copper/Polymer B..:

, In: 2024 International VLSI Symposium on Technology, Systems and Applications (VLSI TSA),
Ouyang, Tsung- Yu ; Lin, Yu-Min ; Chan, Yu-Ping... - p. 1-2 , 2024
Link: https://doi.org/10.1109/..
 
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5

From the Perspective of High-Risk Leisure Environment: A St..:

, In: The 6th International Symposium on Water Resource and Environmental Management; Environmental Science and Engineering,
Lin, Hsiao-Hsien ; Lo, Chih-Cheng ; Perng, Yuan-Shing... - p. 229-243 , 2024
Link: https://doi.org/10.1007/..
 
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6

Effect of Passivation on BEOL-Compatible Oxide Semiconducto..:

, In: 2024 International VLSI Symposium on Technology, Systems and Applications (VLSI TSA),
Kuo, Chi-Yuan ; Lo, Tsung-Tien ; Chiu, Yun-Ping... - p. 1-2 , 2024
Link: https://doi.org/10.1109/..
 
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7

Effects of Channel Thickness on DC/RF Performance of InAlGa..:

, In: 2024 International VLSI Symposium on Technology, Systems and Applications (VLSI TSA),
Shieh, De ; Lee, Zheng-Fong ; Lee, Ming-Yuan... - p. 1-2 , 2024
Link: https://doi.org/10.1109/..
 
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8

A Refractive Distortion Correction Method for 3D Root Recon..:

, In: 2023 Sixth International Symposium on Computer, Consumer and Control (IS3C),
Li, Mu-Wei ; Wu, Po-Lung ; Lo, Shuen-Fang.. - p. 114-117 , 2023
Link: https://doi.org/10.1109/..
 
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9

GaN on Si RF performance with different AlGaN back barrier:

, In: 2023 International VLSI Symposium on Technology, Systems and Applications (VLSI-TSA/VLSI-DAT),
Hsieh, Chang-Yan ; Chen, Hui-Yu ; Tu, Po-Tsung... - p. 1-2 , 2023
Link: https://doi.org/10.1109/..
 
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10

Highly Reliable, Scalable, and High-Yield HfZrOx FRAM by Ba..:

, In: 2022 International Electron Devices Meeting (IEDM),
Lin, Yu-De ; Yeh, Po-Chun ; Dai, Jheng-Yang... - p. 32.1.1-32.1.4 , 2022
Link: https://doi.org/10.1109/..
 
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11

An Embedded Multi-Die Active Bridge (EMAB) Chip for Rapid-P..:

, In: 2022 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits),
Zhang, Jie ; Lu, Wei ; Huang, Po-Tsang... - p. 262-263 , 2022
Link: https://doi.org/10.1109/..
 
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12

Area Scalable Hafnium-Zirconium-Oxide Ferroelectric Capacit..:

, In: 2022 International Symposium on VLSI Technology, Systems and Applications (VLSI-TSA),
Huang, Tz-Shiuan ; Yeh, Po-Chun ; Yang, Hsin-Yun... - p. 1-2 , 2022
Link: https://doi.org/10.1109/..
 
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13

In-Memory Annealing Unit (IMAU): Energy-Efficient (2000 TOP..:

, In: 2021 IEEE International Electron Devices Meeting (IEDM),
Hong, Ming-Chun ; Cho, Le-Chih ; Lin, Chih-Sheng... - p. 21.3.1-21.3.4 , 2021
Link: https://doi.org/10.1109/..
 
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14

Improving Edge Dead Domain and Endurance in Scaled HfZrOx F..:

, In: 2021 IEEE International Electron Devices Meeting (IEDM),
Lin, Yu-De ; Yeh, Po-Chun ; Tang, Ying-Tsan... - p. 6.4.1-6.4.4 , 2021
Link: https://doi.org/10.1109/..
 
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15

CMOS-compatible GaN HEMT on 200mm Si-substrate for RF appli..:

, In: 2021 International Symposium on VLSI Technology, Systems and Applications (VLSI-TSA),
Yeh, Po-Chun ; Tu, Po-Tsung ; Liu, Hsueh-Hsing... - p. 1-2 , 2021
Link: https://doi.org/10.1109/..
 
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