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2020 IEEE 70th Electronic Components and Technology Conference (ECTC) ,
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Scalable Chiplet package using Fan-Out Embedded Bridge:
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Advances in Intelligent Systems and Computing; Human Interaction, Emerging Technologies and Future Applications II ,
2
Development of User-Drawn Doodles for Communication and Rep..:
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2016 3rd International Conference on Devices, Circuits and Systems (ICDCS) ,
3
Temperature coefficient of resistance related to amorphous ..:
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Advances in Intelligent Systems and Computing; 2020 International Conference on Applications and Techniques in Cyber Intelligence ,
5
Analysis of Smooth Operation of Members and Cooperatives Ba..:
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2020 IEEE International Conference on Consumer Electronics - Taiwan (ICCE-Taiwan) ,
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SVM-Based Root Identification Algorithm Using Ridge Feature..:
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2017 IEEE 7th International Symposium on Cloud and Service Computing (SC2) ,
8
Integrating Service QFD and TRIZ for a Lucky Draw System De..:
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Communications in Computer and Information Science; Technologies and Applications of Artificial Intelligence ,
11
IMF-PSO: A Particle Swarm Optimization Algorithm for Featur..:
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2024 International VLSI Symposium on Technology, Systems and Applications (VLSI TSA) ,
12
A Resistor-Based High-Resolution Temperature-to-Digital Con..:
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2023 IEEE 10th Workshop on Wide Bandgap Power Devices & Applications (WiPDA) ,
13
Fabrication AlGaN/GaN Fin-HEMTs With Hexagon Nano-scale Fin..:
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2023 9th International Conference on Applied System Innovation (ICASI) ,
14
A Research Structure of Big Data Analysis and Application f..:
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2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ,
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