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X
Mertens, F, G
59  Ergebnisse:
Buchkapitel (Online) X
Personensuche X
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1

Contributors:

, In: Additive Manufacturing,
Alheib, O. ; Arias-González, F. ; Babkin, K.D.... - p. xiii-xvii , 2021
Link: https://doi.org/10.1016/..
 
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2

List of Contributors:

, In: McEvoy's Handbook of Photovoltaics,
Almonacid, Florencia ; Andreev, Vyacheslav M. ; Bailey, Sheila... - p. xix-xxii , 2018
Link: https://doi.org/10.1016/..
 
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3

List of Contributors:

, In: Practical Handbook of Photovoltaics,
Alsema, Erik ; Andreev, Vyacheslav M. ; Bailey, Sheila... - p. xx-xxiv , 2012
Link: https://doi.org/10.1016/..
 
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4

Nanosheet-based Complementary Field-Effect Transistors (CFE..:

, In: 2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits),
Mertens, H. ; Hosseini, M. ; Chiarella, T.... - p. 1-2 , 2023
Link: https://doi.org/10.23919..
 
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5

Using a Mixed-method Approach to Identify Urban Mobility Ne..:

, In: 2023 IEEE International Conference on Industrial Engineering and Engineering Management (IEEM),
Riesener, M. ; Kuhn, M. ; Mertens, M.... - p. 1088-1092 , 2023
Link: https://doi.org/10.1109/..
 
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6

Characterization of a Low Noise and Low Background Charge S..:

, In: 2023 IEEE Nuclear Science Symposium, Medical Imaging Conference and International Symposium on Room-Temperature Semiconductor Detectors (NSS MIC RTSD),
Butta, D. ; Meli, G. ; Bosio, F.... - p. 1-1 , 2023
Link: https://doi.org/10.1109/..
 
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7

Forksheet FETs with Bottom Dielectric Isolation, Self-Align..:

, In: 2022 International Electron Devices Meeting (IEDM),
Mertens, H. ; Ritzenthaler, R. ; Oniki, Y.... - p. 23.1.1-23.1.4 , 2022
Link: https://doi.org/10.1109/..
 
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8

Design of a Low Noise and Low Background Charge Sensitive A..:

, In: 2022 IEEE Nuclear Science Symposium and Medical Imaging Conference (NSS/MIC),
Butta, D. ; Meli, G. ; Carminati, M.... - p. 1-4 , 2022
Link: https://doi.org/10.1109/..
 
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9

Buried Power Rail Metal exploration towards the 1 nm Node:

, In: 2021 IEEE International Electron Devices Meeting (IEDM),
Gupta, A. ; Radisic, D. ; Maes, J. W.... - p. 22.5.1-22.5.4 , 2021
Link: https://doi.org/10.1109/..
 
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10

Inspection and metrology challenges for 3 nm node devices a..:

, In: 2021 IEEE International Electron Devices Meeting (IEDM),
Shohjoh, T. ; Ikota, M. ; Isawa, M.... - p. 3.3.1-3.3.4 , 2021
Link: https://doi.org/10.1109/..
 
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11

Comparison of Electrical Performance of Co-Integrated Forks..:

, In: 2021 IEEE International Electron Devices Meeting (IEDM),
Ritzenthaler, R. ; Mertens, H. ; Eneman, G.... - p. 26.2.1-26.2.4 , 2021
Link: https://doi.org/10.1109/..
 
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12

Buried Power Rail Scaling and Metal Assessment for the 3 nm..:

, In: 2020 IEEE International Electron Devices Meeting (IEDM),
Gupta, A. ; Pedreira, O. Varela ; Tao, Z.... - p. 20.3.1-20.3.4 , 2020
Link: https://doi.org/10.1109/..
 
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13

Buried Power Rail Integration with Si FinFETs for CMOS Scal..:

, In: 2020 IEEE Symposium on VLSI Technology,
Gupta, A. ; Mertens, H. ; Tao, Z.... - p. 1-2 , 2020
Link: https://doi.org/10.1109/..
 
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14

Contributors:

, In: Practice of Clinical Echocardiography,
Aboulhosn, Jamil A. ; Abraham, Theodore P. ; Akoum, Nazem... - p. v-x , 2017
Link: https://doi.org/10.1016/..
 
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15

Harmonic propagation analysis in electric energy distributi..:

, In: 11th International Conference on Electrical Power Quality and Utilisation,
Oliveira, L. C. O. ; e Melo, G. A. ; Souza, J. B.... - p. 1-6 , 2011
Link: https://doi.org/10.1109/..
 
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