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Mi, Tao-Mian
20  Ergebnisse:
Buchkapitel (Online) X
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1

3D Co-packaging of GaN/SiC Cascode Device for High-Frequenc..:

, In: 2024 36th International Symposium on Power Semiconductor Devices and ICs (ISPSD),
Shu, Ji ; Sun, Jiahui ; Tao, Mian... - p. 486-489 , 2024
Link: https://doi.org/10.1109/..
 
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2

Stability Study of Quantum Dot Color Converted Mini/Micro-L..:

, In: 2024 International Conference on Electronics Packaging (ICEP),
Cheng, Yuanjie ; Lo, Jeffery C.C. ; Qiu, Xing... - p. 1-2 , 2024
Link: https://doi.org/10.23919..
 
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3

Pillar-Cavity Copper-Copper Bonding for Face-to-Face Carbon..:

, In: 2023 IEEE CPMT Symposium Japan (ICSJ),
Xu, Hua ; Lo, Jeffery C.C. ; Qiu, Xing... - p. 21-24 , 2023
Link: https://doi.org/10.1109/..
 
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4

Quantum Dot Color Conversion Film with Enhanced Color Rende..:

, In: 2023 International Conference on Electronics Packaging (ICEP),
Cheng, Yuanjie ; Lo, Jeffery C. C. ; Qiu, Xing... - p. 135-136 , 2023
Link: https://doi.org/10.23919..
 
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5

Long-term Stability Evaluation of Thermal Interface Materia..:

, In: 2019 20th International Conference on Electronic Packaging Technology(ICEPT),
Lo, Jeffery C. C. ; Tao, Mian ; Cheng, Yuanjie... - p. 1-4 , 2019
Link: https://doi.org/10.1109/..
 
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6

Chip-First Fan-Out Panel-Level Packaging for Heterogeneous ..:

, In: 2018 IEEE 68th Electronic Components and Technology Conference (ECTC),
Ko, Cheng-Ta ; Chang, Chieh-Lin ; Pan, Jhih-Yuan... - p. 355-363 , 2018
Link: https://doi.org/10.1109/..
 
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7

Reliability of Fan-Out Wafer-Level Packaging with Large Chi..:

, In: 2018 IEEE 68th Electronic Components and Technology Conference (ECTC),
Lau, John ; Kuah, Eric ; Li, Zhang... - p. 1574-1582 , 2018
Link: https://doi.org/10.1109/..
 
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8

Fan-Out Wafer-Level Packaging for Heterogeneous Integration:

, In: 2018 IEEE 68th Electronic Components and Technology Conference (ECTC),
Lau, John ; Li, Zhang ; Tan, Kim Hwee... - p. 2360-2366 , 2018
Link: https://doi.org/10.1109/..
 
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9

Transient light emission microscopy for detecting the non-u..:

, In: 2017 33rd Thermal Measurement, Modeling & Management Symposium (SEMI-THERM),
Tao, Mian ; Ricky Lee, S.W. - p. 297-301 , 2017
Link: https://doi.org/10.1109/..
 
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10

Mode Multiplexer Based on Multiplane Light Conversion Using..:

, In: 2023 Asia Communications and Photonics Conference/2023 International Photonics and Optoelectronics Meetings (ACP/POEM),
Wu, Mian ; Wu, Lin ; Tao, Jin - p. 1-2 , 2023
Link: https://doi.org/10.1109/..
 
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11

Ultra-Sensitive Fiber Fabry-Perot Temperature Sensor Based ..:

, In: 2023 Asia Communications and Photonics Conference/2023 International Photonics and Optoelectronics Meetings (ACP/POEM),
Li, Zhen ; Xu, Wei ; Chen, Enqing... - p. 1-3 , 2023
Link: https://doi.org/10.1109/..
 
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12

List of contributors:

, In: Integrated Photonics for Data Communication Applications,
Abel, Stefan ; Ahn, Donghwan ; Akulova, Yuliya... - p. xv-xx , 2023
Link: https://doi.org/10.1016/..
 
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13

Full-Scale Isogeometric Topology Optimization of Porous Thi..:

, In: Computational and Experimental Simulations in Engineering; Mechanisms and Machine Science,
Huang, Mingzhe ; Xiao, Mi ; Gao, Liang.. - p. 105-119 , 2023
Link: https://doi.org/10.1007/..
 
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14

Decoupled Hyperbolic Graph Attention Network for Modeling S..:

, In: Proceedings of the 31st ACM International Conference on Information & Knowledge Management,
Zhou, Zhiheng ; Wang, Tao ; Hou, Linfang... - p. 2763-2772 , 2022
Link: https://dl.acm.org/doi/1..
 
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15

Production Prediction of Shale Oil Horizontal Wells Conside..:

, In: Proceedings of the International Field Exploration and Development Conference 2021; Springer Series in Geomechanics and Geoengineering,
Ou-Yang, Wei-ping ; Wu, Tao ; Zhang, Mian. - p. 176-188 , 2022
Link: https://doi.org/10.1007/..
 
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