Moura, Alex R.
130  Ergebnisse:
Personensuche X
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1

Contributors:

, In: Microbial and Natural Macromolecules,
Abdella, Bahaa ; Abdella, Mohamed ; Abdulhameed, Sabu... - p. xxi-xxvi , 2021
 
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2

An Investigation of Mechanical and Thermal Properties of Po..:

, In: The Minerals, Metals & Materials Series; Characterization of Minerals, Metals, and Materials 2019,
 
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3

Production and Characterization of a Hybrid Composite of Po..:

, In: The Minerals, Metals & Materials Series; Characterization of Minerals, Metals, and Materials 2019,
 
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4

Contributors:

, In: Applications of Nanobiotechnology for Neglected Tropical Diseases,
Aderibigbe, B.A. ; Akolade, Jubril O. ; Alex Christon, R.... - p. xvii-xxiii , 2021
 
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5

List of contributors:

, In: Seafloor Geomorphology as Benthic Habitat,
Abernethy, C. ; Acoba, T. ; Alvarez, Belinda... - p. xxxi-xlii , 2020
 
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6

Comparative Study of the Use of Rice Husk Ashes and Graphit..:

, In: The Minerals, Metals & Materials Series; Characterization of Minerals, Metals, and Materials 2019,
 
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8

Contributors:

, In: Microbiome and Metabolome in Diagnosis, Therapy, and other Strategic Applications,
 
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9

A Self-Organizing Map Clustering Approach to Support Territ..:

, In: Progress in Pattern Recognition, Image Analysis, Computer Vision, and Applications; Lecture Notes in Computer Science,
 
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10

Impact of Soil Water Content and Porosity on Lightning Indu..:

, In: 2023 15th IEEE International Conference on Industry Applications (INDUSCON),
 
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12

Lightning-Induced Overvoltage Peaks Considering Soil Parame..:

, In: 2023 15th IEEE International Conference on Industry Applications (INDUSCON),
 
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13

Analysis of Transmission Line Parameters Considering Multil..:

, In: 2022 IEEE XXIX International Conference on Electronics, Electrical Engineering and Computing (INTERCON),
 
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14

Lightning-Induced Overvoltage Peaks Considering Soil Parame..:

, In: 2022 20th International Conference on Harmonics & Quality of Power (ICHQP),
 
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15

Analysis of the Overvoltage on Transmission Line Considerin..:

, In: 2022 IEEE XXIX International Conference on Electronics, Electrical Engineering and Computing (INTERCON),
 
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