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2024 IEEE Silicon Photonics Conference (SiPhotonics) ,
1
Direct-Drive 224 Gbps/λ PAM4 and 112 Gbps/λ NRZ Silicon Pho..:
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2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ,
2
A Compact Wafer-Level Heterogeneously Integrated Scalable O..:
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2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) ,
3
Characterization of Differential TMV Vertical Interconnects..:
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2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) ,
4
Physical Verification for 3D Heterogeneous Integrated Elect..:
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2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ,
5
A Heterogeneously Integrated Wafer-level Processed Co-Packa..:
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2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ,
6
Characterization of 224 Gbps/lambda Interconnects in Co-Pac..:
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2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) ,
7
Solutions for Process Challenges on Fan-Out Wafer Level Pac..:
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2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ,
8
A Novel Packaging Platform for High-Performance Optical Eng..:
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2020 IEEE 70th Electronic Components and Technology Conference (ECTC) ,
9
Defect Localization in Through-Si-Interposer Based 2.5D ICs:
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2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC) ,
10
Non-destructive fault isolation in through-silicon interpos..:
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2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC) ,
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