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2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ,
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Direct Die to Wafer Cu Hybrid Bonding for Volume Production:
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2023 24th International Conference on Electronic Packaging Technology (ICEPT) ,
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Optimization of packaging process in Ag sintering for ultra..:
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2023 15th International Conference on COMmunication Systems & NETworkS (COMSNETS) ,
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Web-based Training Platform with AR Games for Dyslexic Chil..:
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Advances in Intelligent Systems and Computing; Advances in Safety Management and Human Factors ,
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Aggregate-Level Data Characteristics of Safety Climate with..:
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Human Systems Engineering and Design II; Advances in Intelligent Systems and Computing ,
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