Ng, Alice Hoi-Man
5  Ergebnisse:
Personensuche X
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1

Direct Die to Wafer Cu Hybrid Bonding for Volume Production:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Fan, Chun Ho ; Ng, Hoi Ping ; So, Siu Cheung... - p. 91-96 , 2023
 
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2

Optimization of packaging process in Ag sintering for ultra..:

, In: 2023 24th International Conference on Electronic Packaging Technology (ICEPT),
 
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3

Web-based Training Platform with AR Games for Dyslexic Chil..:

, In: 2023 15th International Conference on COMmunication Systems & NETworkS (COMSNETS),
Yuen, Man-Ching ; Ng, Ka-Fai ; Yung, Chi-Wai... - p. 1-6 , 2023
 
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4

Aggregate-Level Data Characteristics of Safety Climate with..:

, In: Advances in Intelligent Systems and Computing; Advances in Safety Management and Human Factors,
Man, Siu Shing ; Ng, Jacky Yu Ki ; Law, Kar Ying. - p. 180-189 , 2019
 
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5

A Review of the Risk Perception of Construction Workers in ..:

, In: Human Systems Engineering and Design II; Advances in Intelligent Systems and Computing,
 
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