Ich stimme zu, dass diese Seite Cookies verwende. Weitere Informationen finden Sie unter unseren Datenschutzerklärungen .
X
Ng, Lim Huat
34  Ergebnisse:
Buchkapitel (Online) X
Personensuche X
?
1

Design and Development of Filament Extruder for 3D Printing..:

, In: Lecture Notes in Mechanical Engineering; Proceedings of the 7th International Conference and Exhibition on Sustainable Energy and Advanced Materials (ICE-SEAM 2021), Melaka, Malaysia,
Ng, Lim Huat ; Mat, Shafizal ; Abdul Kudus, Syahibudil Ikhwan... - p. 3-7 , 2022
Link: https://doi.org/10.1007/..
 
?
2

Three-dimensional (3D) Dynamic Obstacle Perception in a Det..:

, In: 2019 International Conference on Unmanned Aircraft Systems (ICUAS),
Lim, Catrina ; Li, Boyang ; Ng, Ee Meng.. - p. 996-1004 , 2019
Link: https://doi.org/10.1109/..
 
?
3

Generative sEMG Deep Learning for Early Prediction of Locom..:

, In: IECON 2023- 49th Annual Conference of the IEEE Industrial Electronics Society,
Huang, Zhanfeng ; Lin, Zhiping ; Zhang, Haihong... - p. 1-6 , 2023
Link: https://doi.org/10.1109/..
 
?
4

Learning Transient Electromyographic Activities during Lowe..:

, In: 2023 IEEE 18th Conference on Industrial Electronics and Applications (ICIEA),
Jin, Huiwen ; Lin, Zhiping ; Chen, Yongming... - p. 1896-1901 , 2023
Link: https://doi.org/10.1109/..
 
?
5

Effect of Package Singulation Parameters on Dual Flat Non-l..:

, In: 2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT),
Wu, Siying ; Tan, Shwu Miin ; Xue, Jianlu.. - p. 1-4 , 2022
Link: https://doi.org/10.1109/..
 
?
6

The Effect of Different Age Hardening Conditions Towards Me..:

, In: Lecture Notes in Mechanical Engineering; Recent Trends in Manufacturing and Materials Towards Industry 4.0,
Yahaya, Shamy Nazrein Md ; Ng, Chuan Huat ; Lai, Chee Fung.. - p. 363-378 , 2021
Link: https://doi.org/10.1007/..
 
?
7

Review on Acoustic Emission Monitoring System for Hot Stamp..:

, In: Lecture Notes in Mechanical Engineering; Recent Trends in Manufacturing and Materials Towards Industry 4.0,
Lai, Chee Fung ; Wong, Hui Ing ; Ng, Chuan Huat.. - p. 379-394 , 2021
Link: https://doi.org/10.1007/..
 
?
8

Perfect molding challenges and the limitations:

, In: 2017 IEEE 19th Electronics Packaging Technology Conference (EPTC),
Tan, Lay Tatt ; Teo, Yin Yin ; Lee, Chee Hong. - p. 1-6 , 2017
Link: https://doi.org/10.1109/..
 
?
9

Steps to prevent quality and reliability issues resulted fr..:

, In: 2016 IEEE 37th International Electronics Manufacturing Technology (IEMT) & 18th Electronics Materials and Packaging (EMAP) Conference,
Bin Md Derus, Rozazmi ; Bin Roslan, Muhammad Syafiq ; Bin Zainal, Mohd Syafiq.. - p. 1-4 , 2016
Link: https://doi.org/10.1109/..
 
?
10

Towards precise tracking of electric-mechanical cardiac tim..:

, In: 2017 39th Annual International Conference of the IEEE Engineering in Medicine and Biology Society (EMBC),
Zhang, Haihong ; Wang, Zimin ; Dong, Kejun.. - p. 751-754 , 2017
Link: https://doi.org/10.1109/..
 
?
11

Investigation of Bifacial Gain and Albedo of Bifacial Photo..:

, In: 2024 8th International Conference on Green Energy and Applications (ICGEA),
Tan, Hui Li ; Lim, Boon Han ; Tan, Ming Hui... - p. 265-270 , 2024
Link: https://doi.org/10.1109/..
 
?
12

Doping-selective etching of silicon for wafer thinning in t..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Venkataraman, Nandini ; Risse, Benedikt ; Decierdo, Gregorio... - p. 1524-1530 , 2023
Link: https://doi.org/10.1109/..
 
?
13

A Reliability Framework for Safe Octorotor UAV Flight Opera..:

, In: 2023 International Conference on Unmanned Aircraft Systems (ICUAS),
T., Thanaraj ; Govind, Siddesh ; Roy, Anurag.. - p. 1013-1020 , 2023
Link: https://doi.org/10.1109/..
 
?
14

The Impact of Track Elevations for DC Third Rail System in ..:

, In: 2023 IEEE 13th Symposium on Computer Applications & Industrial Electronics (ISCAIE),
Chua, Xin Rong ; Chua, Kein Huat ; Hau, Lee Cheun... - p. 279-282 , 2023
Link: https://doi.org/10.1109/..
 
?
15

An Optimized Lightweight Model for Real-Time Wood Defects D..:

, In: 2022 IEEE International Conference on Automatic Control and Intelligent Systems (I2CACIS),
Lim, Wei-Han ; Bonab, Mohammad Babrdel ; Chua, Kein Huat - p. 186-191 , 2022
Link: https://doi.org/10.1109/..
 
1-15