E-LIB Suche - Ergebnisse für: Ngo, Van Duong

1

Optimal Operation of Energy Storage Systems for Peak Load S..:

, In: 2023 International Conference on System Science and Engineering (ICSSE),

Nguyen, Nhi Thi Ai ; Le, Dinh Duong ; Ngo, Van Duong.. - p. 327-331 , 2023

Link: https://doi.org/10.1109/..

2

Electronics design of piezo-resistive MEMS microphone array..:

, In: 2023 Symposium on Design, Test, Integration & Packaging of MEMS/MOEMS (DTIP),

Garcia-Souto, Jose A. ; Baez-Rivera, Cindy A. ; Erbacher, Kolja... - p. 1-5 , 2023

Link: https://doi.org/10.1109/..

3

Proposal to Improve The Classification of School Violence:

, In: Proceedings of the 2023 7th International Conference on Machine Learning and Soft Computing,

Ngo, Ha Duong ; Tran, Y Nhu - p. 157-160 , 2023

Link: https://dl.acm.org/doi/1..

4

Aero Acoustic MEMS Microphone Integration in Ultra-Thin and..:

, In: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC),

Erbacher, Kolja ; Marques, Joao Alves ; von Krshiwoblozki, Malte... - p. 15-18 , 2022

Link: https://doi.org/10.1109/..

5

A Novel Piezoresitive Microphone MEMS Sensor For Aerospace ..:

, In: 2022 International Conference on Electrical, Computer and Energy Technologies (ICECET),

Ngo, Ha Duong ; Erbacher, Kolja ; Wu, Lixiang... - p. 1-5 , 2022

Link: https://doi.org/10.1109/..

6

MCLDA: Multi-level Contrastive Learning for Domain Adaptive..:

, In: Proceedings of the 12th International Symposium on Information and Communication Technology,

Duong, Ngo-Kien ; Nguyen, Thi-Oanh ; Dinh, Viet-Sang - p. 343-350 , 2023

Link: https://dl.acm.org/doi/1..

7

Design and Simulation of a Bi-Directional CLLC Resonant DC-..:

, In: 2024 10th International Conference on Applied System Innovation (ICASI),

Ngo, Chi-Duong ; Chen, Ming-Hung - p. 31-33 , 2024

Link: https://doi.org/10.1109/..

8

Investigation of Etching SIC VIAS for High Power Elctronics..:

, In: 2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC),

Mackowiak, Piotr ; Erbacher, Kolja ; Schiffer, Michael... - p. 1-6 , 2020

Link: https://doi.org/10.1109/..

9

Fabrication of High Voltage Capable TSV Using Backside via ..:

, In: 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC),

Mackowiak, Piotr ; Wilke, Martin ; Wohrmann, Markus... - p. 83-86 , 2019

Link: https://doi.org/10.1109/..

10

Retaining System Against Rockfall Near a Highway in Vietnam..:

, In: Lecture Notes in Civil Engineering; Geotechnics for Sustainable Infrastructure Development,

Duong-Ngo, Huy ; Do-Tuan, Nghia ; Nguyen-Chau, Lan - p. 865-869 , 2019

Link: https://doi.org/10.1007/..

11

Investigation of IDC Structures for Graphene Based Biosenso..:

, In: 2019 12th International Conference on Developments in eSystems Engineering (DeSE),

Baeuscher, Manuel ; Reinicke, Oliver ; Henke, Matthaus... - p. 939-942 , 2019

Link: https://doi.org/10.1109/..

12

Ultra Thin Force and Acceleration Sensor Embedded in Flexib..:

, In: 2019 12th International Conference on Developments in eSystems Engineering (DeSE),

Mackowiak, Piotr ; Erbacher, Kolja ; Zoschke, Kai... - p. 902-905 , 2019

Link: https://doi.org/10.1109/..

13

High Density Flex and Thin Chip Embedding Technology for Po..:

, In: 2019 International Wafer Level Packaging Conference (IWLPC),

Zoschke, Kai ; Mackowiak, Piotr ; Ngo, Ha-Duong... - p. 1-9 , 2019

Link: https://doi.org/10.23919..

14

Piezoresistive Pressure Sensors for Applications in Harsh E..:

, In: Modern Sensing Technologies; Smart Sensors, Measurement and Instrumentation,

Ngo, Ha-Duong ; Ehrmann, Oswin ; Schneider-Ramelow, Martin. - p. 231-251 , 2018

Link: https://doi.org/10.1007/..

15

Applications of Image Processing Techniques to Determine th..:

, In: 2023 8th International Scientific Conference on Applying New Technology in Green Buildings (ATiGB),

Thai, Pham Quoc ; Van Hoa, Duong ; Tu, Nong Trong... - p. 253-256 , 2023

Link: https://doi.org/10.1109/..