Nguyen, Hoang Vu
1686  Ergebnisse:
Personensuche X
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1

GeoGebra-Assisted Teaching of Rotation in Geometric Problem..:

, In: Advances in Intelligent Systems and Computing; Proceedings of 3rd International Conference on Mathematical Modeling and Computational Science,
 
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2

Complex Shapes Prosthetics Process: An Application of Fused..:

, In: 3D Printing in Biomedical Engineering; Materials Horizons: From Nature to Nanomaterials,
 
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3

Detecting correlated columns in relational databases with m..:

, In: Proceedings of the 26th International Conference on Scientific and Statistical Database Management,
 
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4

Face recognition based on Low-Rank matrix Representation:

, In: Proceedings of the 33rd Chinese Control Conference,
Nguyen, Hoang Vu ; Huang, Rong ; Yang, Wankou. - p. 4647-4652 , 2014
 
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5

Chapter 3. Soviet-Style Apartment Complexes in Hanoi: An In..:

, In: An Anthropology of Intellectual Exchange,
Huy, Nguyen Van ; Hoang, Nguyen Vu - p. 89-112 , 2023
 
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6

Using an improved Neural Network with Bacterial Foraging Op..:

, In: 2023 International Conference on System Science and Engineering (ICSSE),
 
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7

Application of Moody Chart Method in Load Ranking in Power ..:

, In: 2023 International Conference on System Science and Engineering (ICSSE),
 
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8

Forecast on vietnam electricity consumption to 2030:

, In: 2017 International Conference on Electrical Engineering and Informatics (ICELTICs),
 
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9

Investigate the Frequency Effect to the Deformation and Vib..:

, In: 2023 8th International Scientific Conference on Applying New Technology in Green Buildings (ATiGB),
Do, Chi-Phi ; Doan, Thanh-Bao ; Le, Dinh-Kha. - p. 136-141 , 2023
 
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10

Thermally Conductive Polymer Composites with Hexagonal Boro..:

, In: 2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC),
 
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11

Wafer Level Capping Technology for Vacuum Packaging of Micr..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
 
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12

Assembly of Ultra-Thin MEMS Device on Driver Chip Using Ani..:

, In: 2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC),
 
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13

Low-Temperature Cu–(Sn–Bi) Solid Liquid Interdiffusion Bond..:

, In: 2023 IMAPS Nordic Conference on Microelectronics Packaging (NordPac),
 
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14

Encapsulation of Biosensor for Stress Monitoring in Fish: A..:

, In: 2023 IMAPS Nordic Conference on Microelectronics Packaging (NordPac),
 
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15

Information Technology Skills Extractor for Job Description..:

, In: The 12th Conference on Information Technology and Its Applications; Lecture Notes in Networks and Systems,
 
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