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Ning, Cheng-cheng
416  Ergebnisse:
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1

Recent Progress of Pulsed-Power-Driven High Energy Density ..:

, In: 2020 IEEE International Conference on Plasma Science (ICOPS),
Deng, Jianjun ; Xie, Weiping ; Wang, Meng... - p. 8-8 , 2020
Link: https://doi.org/10.1109/..
 
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2

Improved immune algorithm based on a global strategy:

, In: Proceedings of 2014 IEEE Chinese Guidance, Navigation and Control Conference,
Jing, Xian Yong. ; Hou, Man Yi. ; Wang, Wei Peng... - p. 2140-2143 , 2014
Link: https://doi.org/10.1109/..
 
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3

SIP Solder Paste via Powder Cluster Design Harvest Both Slu..:

, In: 2023 24th International Conference on Electronic Packaging Technology (ICEPT),
Xu, Zhengfeng ; Wang, Jian ; Lee, Ning-Cheng... - p. 1-4 , 2023
Link: https://doi.org/10.1109/..
 
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4

Sip Solder Paste with Superior Slump Resistance via Powder ..:

, In: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT),
Xu, Zhengfeng ; Zheng, Aixia ; Wang, Jian.. - p. 1-6 , 2022
Link: https://doi.org/10.1109/..
 
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5

Design for Reliability of Solder Joints:

, In: Assembly and Reliability of Lead-Free Solder Joints,
Lau, John H. ; Lee, Ning-Cheng - p. 415-483 , 2020
Link: https://doi.org/10.1007/..
 
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6

Advanced Specialty Flux Design:

, In: Assembly and Reliability of Lead-Free Solder Joints,
Lau, John H. ; Lee, Ning-Cheng - p. 217-298 , 2020
Link: https://doi.org/10.1007/..
 
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7

Soldering Processes:

, In: Assembly and Reliability of Lead-Free Solder Joints,
Lau, John H. ; Lee, Ning-Cheng - p. 137-216 , 2020
Link: https://doi.org/10.1007/..
 
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8

Prevailing Lead-Free Materials:

, In: Assembly and Reliability of Lead-Free Solder Joints,
Lau, John H. ; Lee, Ning-Cheng - p. 63-136 , 2020
Link: https://doi.org/10.1007/..
 
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9

Pressureless Sintering Process of Ag Sinter Paste Bonding A..:

, In: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC),
Fan, Guangyu ; Labarbera, Christine ; Lee, Ning-Cheng.. - p. 1338-1343 , 2020
Link: https://doi.org/10.1109/..
 
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10

Versatile TIM Solution with Chain Network Solder Composite:

, In: 2020 21st International Conference on Electronic Packaging Technology (ICEPT),
Mao, Runsheng ; Chen, Sihai ; Zito, Elaina.. - p. 1-6 , 2020
Link: https://doi.org/10.1109/..
 
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11

Reliability Tests and Data Analyses of Solder Joints:

, In: Assembly and Reliability of Lead-Free Solder Joints,
Lau, John H. ; Lee, Ning-Cheng - p. 355-413 , 2020
Link: https://doi.org/10.1007/..
 
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12

Solder Joint Characterization:

, In: Assembly and Reliability of Lead-Free Solder Joints,
Lau, John H. ; Lee, Ning-Cheng - p. 299-354 , 2020
Link: https://doi.org/10.1007/..
 
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13

Failure Analysis of Solder Joints:

, In: Assembly and Reliability of Lead-Free Solder Joints,
Lau, John H. ; Lee, Ning-Cheng - p. 485-520 , 2020
Link: https://doi.org/10.1007/..
 
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14

Solder Joints in PCB Assembly and Semiconductor Packaging:

, In: Assembly and Reliability of Lead-Free Solder Joints,
Lau, John H. ; Lee, Ning-Cheng - p. 1-62 , 2020
Link: https://doi.org/10.1007/..
 
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15

A new parameter matching method for a twin motor coupled dr..:

, In: 2014 IEEE Conference and Expo Transportation Electrification Asia-Pacific (ITEC Asia-Pacific),
Zhang, Shuo ; Zhang, Cheng-ning ; Han, Guang-wei. - p. 1-6 , 2014
Link: https://doi.org/10.1109/..
 
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