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2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits) ,
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2D Materials in the BEOL:
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2023 International Electron Devices Meeting (IEDM) ,
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Reliability Assessment of Double-Gated Wafer-Scale MoS2 Fie..:
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2023 International Electron Devices Meeting (IEDM) ,
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High Mobility TMD NMOS and PMOS Transistors and GAA Archite..:
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2022 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits) ,
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300 mm MOCVD 2D CMOS Materials for More (Than) Moore Scalin:
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2022 International Electron Devices Meeting (IEDM) ,
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Gate length scaling beyond Si: Mono-layer 2D Channel FETs R..:
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2021 IEEE International Electron Devices Meeting (IEDM) ,
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Advancing 2D Monolayer CMOS Through Contact, Channel and In..:
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Characterization of Minerals, Metals, and Materials 2022; The Minerals, Metals & Materials Series ,
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Challenges Concerning the Characterization of Cementite in ..:
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2020 American Control Conference (ACC) ,
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Control of Wafer Scanners: Methods and Developments:
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Delamination Behaviour of Composites ,
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Fracture mechanics concepts, stress fields, strain energy r..:
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2001 IEEE International Solid-State Circuits Conference. Digest of Technical Papers. ISSCC (Cat. No.01CH37177) ,
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A 10 Gb/s 16:1 multiplexer and 10 GHz clock synthesizer in ..:
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Proceedings of the conference on European design automation ,
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Towards maximising the use of structural VHDL for synthesis:
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17. Internationales Stuttgarter Symposium; Proceedings ,
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A Miller cycle engine without compromise – The Magma concep:
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Tracing Pathogens in the Food Chain ,
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