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2023 International Conference on Electronics Packaging (ICEP) ,
1
1/1 µm Line and Space Cu Wiring with Organic Dielectric Thr..:
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2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ,
2
Novel Photo-definable Low Dk & Df Polyimide for Advanced Pa..:
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2020 IEEE 70th Electronic Components and Technology Conference (ECTC) ,
3
Low Permittivity and Dielectric Loss Polyimide with Pattern..:
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