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2022 IEEE International Solid- State Circuits Conference (ISSCC) ,
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A 16Gb 27Gb/s/pin T-coil based GDDR6 DRAM with Merged-MUX T..:
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2019 Electrical Design of Advanced Packaging and Systems (EDAPS) ,
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Electrical and Thermal Co-Analysis of Thermally Efficient S..:
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Digest of Technical Papers. 2005 Symposium on VLSI Technology, 2005. ,
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Highly scalable and reliable 2-bit/cell SONOS memory transi..:
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2023 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) ,
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A Semiconductor Open Failure Analysis Assisted by Scanning ..:
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Proceedings of the 2nd International Conference on Interaction Sciences: Information Technology, Culture and Human ,
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Vertical handover between LTE and wireless LAN systems base..:
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2009 IEEE International Reliability Physics Symposium ,
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Systematic study on bias temperature instability of various..:
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Software Engineering, Artificial Intelligence, Networking and Parallel/Distributed Computing; Studies in Computational Intelligence ,
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The Effects of Product's Visual Preview and Customer Review..:
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2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) ,
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Effective Substrate Thermal Conductivity Modeling Method Ex..:
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2008 Flexible Electronics and Displays Conference and Exhibition ,
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Development of Plasma-Damage Free Neutral Beam Sputtering S..:
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2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) ,
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