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Ong, Brandon Jin Yang
5  Ergebnisse:
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1

Challenges for Enabling Multiple High-Speed Interfaces On A..:

, In: 2022 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI),
Kondapuram, Esha ; Ong, Chong-Jin ; Silva, Benjamin. - p. 501-503 , 2022
Link: https://doi.org/10.1109/..
 
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2

Feature selection for support vector regression using proba..:

, In: Proceedings of the 16th ACM SIGKDD international conference on Knowledge discovery and data mining,
Yang, Jian-Bo ; Ong, Chong-Jin - p. 343-352 , 2010
Link: https://dl.acm.org/doi/1..
 
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3

Capillary Underfill Flow Simulation and Experimental Study ..:

, In: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC),
Lai, Jin Yuan ; Yueh Yang, Shin ; Lin, Kohan... - p. 659-663 , 2023
Link: https://doi.org/10.1109/..
 
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4

Quick Assessment Methodology for Thermal Impedance Predicti..:

, In: 2023 18th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT),
Lai, Jin Yuan ; Yang, Shin Yueh ; Ong, Yeow Chon.. - p. 191-194 , 2023
Link: https://doi.org/10.1109/..
 
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5

List of Contributors:

, In: Flexible Robotics in Medicine,
Banerjee, Hritwick ; Cai, Catherine Jiayi ; Cai, Xinchen... - p. xiii-xvi , 2020
Link: https://doi.org/10.1016/..
 
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