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2006 International Conference on Electronic Materials and Packaging ,
1
Industry Drop Tests in Solder Joint Reliability Study of Mo..:
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2020 15th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) ,
2
Predictive Modelling Methodologies for Bi-material Strip Wa..:
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2022 IEEE International Conference on Industrial Engineering and Engineering Management (IEEM) ,
5
A Conceptual Analysis of Green Shipping Practices, Rational..:
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Microfluidic Devices for Biomedical Applications ,
6
Microfluidic systems for drug discovery, pharmaceutical ana..:
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Lecture Notes in Civil Engineering; ICCOEE2020 ,
7
Mechanical Properties of Steel Fibre Reinforced Lightweight..:
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2019 IEEE 9th International Nanoelectronics Conferences (INEC) ,
8
Spatially Mapping Work Function Changes and Defect Evolutio..:
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2019 IEEE 9th International Nanoelectronics Conferences (INEC) ,
9
In-situ Real-Time Observation of Sn-Rich Dots and Wires Dur..:
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2022 IEEE International Conference on Industrial Engineering and Engineering Management (IEEM) ,
11
Assessment of Ship Emission Inventory in Strait of Malacca ..:
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2022 IEEE International Conference on Image Processing (ICIP) ,
13
VG-GAN: Conditional GAN Framework for Graphical Design Gene..:
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Lecture Notes in Civil Engineering; WCFS2020 ,
14
Building Floating Aquaculture Farms with Expanded Polystyre..:
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Lecture Notes in Electrical Engineering; Mobile and Wireless Technology 2018 ,
15