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Ong, Wei Chen
144  Ergebnisse:
Buchkapitel (Online) X
Personensuche X
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1

Contributors:

, In: Dynamic Sedimentary Environments of Mangrove Coasts,
Adams, Janine B. ; Anthony, Edward J. ; Arifanti, Virni Budi... - p. ix-xi , 2021
Link: https://doi.org/10.1016/..
 
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2

List of Contributors:

, In: Polyphenols in Human Health and Disease,
Aguiar Jr, Odair ; Alkholy, Sarah Omar ; Allgrove, Judith... - p. xxiii-xxx , 2014
Link: https://doi.org/10.1016/..
 
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3

Deep Recognition of Facial Expressions in Movies:

, In: 2022 International Conference on Technologies and Applications of Artificial Intelligence (TAAI),
Chen, Lieu-Hen ; Wu, Hsiao-Kuang ; Shimokawara, Eri.. - p. 60-65 , 2022
Link: https://doi.org/10.1109/..
 
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4

List of contributors:

, In: Synthetic and Natural Nanofillers in Polymer Composites,
Abdullah, N. ; Abdul Saad, Wan Aliff ; Ahmad, Muhammad Zamharir... - p. xiii-xviii , 2023
Link: https://doi.org/10.1016/..
 
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5

Design Optimization to Boost Solder Joint Reliability Perfo..:

, In: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC),
Pan, Ling ; Che, Fa Xing ; Yu, Wei... - p. 674-677 , 2023
Link: https://doi.org/10.1109/..
 
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6

Investigation on Underfill Properties Effect on Board Level..:

, In: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC),
Che, Fa Xing ; Ong, Yeow Chon ; Pan, Ling... - p. 705-709 , 2023
Link: https://doi.org/10.1109/..
 
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7

Contributors:

, In: Adsorption of Metals by Geomedia,
Almendarez, Michael G. ; Anderson, Paul ; Anderson, Sharon J.... - p. xix-xxiii , 1998
Link: https://doi.org/10.1016/..
 
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8

Low-Temperature Cu-Cu Bonding Using -oriented and Nanocryst..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Li, Chen-Ning ; Ong, Jia-Juen ; Chiu, Wei-Lan... - p. 1312-1316 , 2024
Link: https://doi.org/10.1109/..
 
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9

Surface Modification by Wet Treatment for Low-Temperature C..:

, In: 2024 International Conference on Electronics Packaging (ICEP),
Chen, Yu-An ; Ong, Jia-Juen ; Chiu, Wei-Lan.. - p. 115-116 , 2024
Link: https://doi.org/10.23919..
 
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10

Non-TCB Process Cu/SiO2 Hybrid Bonding Using Plasma-free Hy..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Chen, Yu-An ; Ong, Jia-Juen ; Chiu, Wei-Lan... - p. 399-403 , 2024
Link: https://doi.org/10.1109/..
 
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11

Fabrication of Highly (111)-oriented Nanotwinned Cu in Fine..:

, In: 2023 International Conference on Electronics Packaging (ICEP),
Yang, Shih-Chi ; Ong., Jia-Juen ; Tran, Dinh-Phuc... - p. 13-14 , 2023
Link: https://doi.org/10.23919..
 
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12

Surface modification on hydrophilicity enhancement using NH..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Ong, Jia-Juen ; Tran, Dinh-Phuc ; Chiu, Wei-Lan... - p. 1549-1552 , 2023
Link: https://doi.org/10.1109/..
 
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13

Fine-pitch -oriented NT-Cu/SiO2 hybrid joints with high the..:

, In: 2023 International Conference on Electronics Packaging (ICEP),
Ong, Jia-Juen ; Chiu, Wei-Lan ; Chang, Hsiang-Hung.. - p. 15-16 , 2023
Link: https://doi.org/10.23919..
 
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14

Study of Application of Taguchi's Method and Neural Network..:

, In: 2023 IEEE 5th Eurasia Conference on IOT, Communication and Engineering (ECICE),
Wu, Dian-Ru ; Ong, Jia-Bin ; Chen, Yen-Ju... - p. 815-820 , 2023
Link: https://doi.org/10.1109/..
 
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15

Low Thermal Budget Cu/SiO2 Hybrid Bonding Using Highly -ori..:

, In: 2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT),
Ong, Jia-Juen ; Tran, Dinh-Phuc ; Hsun, Yu-Min... - p. 1-4 , 2022
Link: https://doi.org/10.1109/..
 
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