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Pae, Eung-Kwon
9  Ergebnisse:
Buchkapitel (Online) X
Personensuche X
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1

Thermo-Mechanical Reliability Characteristics of 8H HBM3:

, In: 2024 IEEE International Reliability Physics Symposium (IRPS),
Bae, Jinsoo ; Noh, HG. ; Yoo, SJ.... - p. 1-6 , 2024
Link: https://doi.org/10.1109/..
 
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2

Virtual FA Methodology for DRAM: Real-Time Analysis and Ris..:

, In: 2024 IEEE International Reliability Physics Symposium (IRPS),
Lee, Jungchul ; Kwon, EC ; Yoon, SH... - p. 1-7 , 2024
Link: https://doi.org/10.1109/..
 
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3

Advanced Self-heating Model and Methodology for Layout Prox..:

, In: 2020 IEEE International Reliability Physics Symposium (IRPS),
Jiang, Hai ; Sagong, Hyunchul ; Kim, Jinju... - p. 1-5 , 2020
Link: https://doi.org/10.1109/..
 
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4

A Comprehensive Reliability Characterization of 5G SoC Mobi..:

, In: 2020 IEEE Symposium on VLSI Technology,
Jin, M. ; Kim, K. ; Kim, B.... - p. 1-2 , 2020
Link: https://doi.org/10.1109/..
 
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5

Reliability on EUV Interconnect Technology for 7nm and beyo..:

, In: 2020 IEEE International Reliability Physics Symposium (IRPS),
Jeong, Tae-Young ; Lee, Miji ; Jo, Yunkyung... - p. 1-4 , 2020
Link: https://doi.org/10.1109/..
 
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6

Reliability of Industrial grade Embedded-STT-MRAM:

, In: 2020 IEEE International Reliability Physics Symposium (IRPS),
Ji, Y. ; Goo, H. ; Lim, J.... - p. 1-3 , 2020
Link: https://doi.org/10.1109/..
 
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7

Early Diagnosis and Prediction of Wafer Quality Using Machi..:

, In: 2020 IEEE International Reliability Physics Symposium (IRPS),
Ko, Heung-Kook ; Park, Sena ; Ryu, Jihyun... - p. 1-5 , 2020
Link: https://doi.org/10.1109/..
 
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8

Impact of BEOL Design on Self-heating and Reliability in Hi..:

, In: 2019 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD),
Choi, Jaehee ; Monga, Udit ; Park, Yonghee... - p. 1-4 , 2019
Link: https://doi.org/10.1109/..
 
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9

Motion-Path Expressions in L2 English and Pedagogical Impli..:

, In: Challenges Encountered by Chinese ESL Learners,
Sun, Jing ; Ai, Haiyang ; Kwon, Yeon-Jin. - p. 333-353 , 2022
Link: https://doi.org/10.1007/..
 
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