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Park, Min-Jae
1069  Ergebnisse:
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1

Test scheduling for system-on-a-chip using test resource gr..:

, In: ASIC, 2003. Proceedings. 5th International Conference on,
Jin Sung Park, Jin Sung Park ; Jae Min Lee, Jae Min Lee ; Upadhyaya, S. - p. None , 2003
Link: https://doi.org/10.1109/..
 
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2

13.4 A 48GB 16-High 1280GB/s HBM3E DRAM with All-Around Pow..:

, In: 2024 IEEE International Solid-State Circuits Conference (ISSCC),
Lee, Jinhyung ; Cho, Kyungjun ; Lee, Chang Kwon... - p. 238-240 , 2024
Link: https://doi.org/10.1109/..
 
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3

Person Re-identification Method Using Text Description Thro..:

, In: 2023 International Conference on Electronics, Information, and Communication (ICEIC),
Kim, Kunho ; Kim, Min-Jae ; Kim, Hyungtae.. - p. 1-4 , 2023
Link: https://doi.org/10.1109/..
 
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4

High-fidelity 3D Human Digitization from Single 2K Resoluti..:

, In: 2023 IEEE/CVF Conference on Computer Vision and Pattern Recognition (CVPR),
Han, Sang-Hun ; Park, Min-Gyu ; Yoon, Ju Hong... - p. 12869-12879 , 2023
Link: https://doi.org/10.1109/..
 
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5

An 81.2dB-SNDR Dual-Residue Pipeline ADC with a 2nd- Order ..:

, In: 2023 IEEE Custom Integrated Circuits Conference (CICC),
Chung, Jae-Hyun ; Kim, Ye-Dam ; Park, Chang-Un... - p. 1-2 , 2023
Link: https://doi.org/10.1109/..
 
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6

A 192-Gb 12-High 896-GB/s HBM3 DRAM with a TSV Auto-Calibra..:

, In: 2022 IEEE International Solid- State Circuits Conference (ISSCC),
Park, Myeong-Jae ; Cho, Ho Sung ; Yun, Tae-Sik... - p. 444-446 , 2022
Link: https://doi.org/10.1109/..
 
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7

22.3 A 128Gb 8-High 512GB/s HBM2E DRAM with a Pseudo Quarte..:

, In: 2020 IEEE International Solid- State Circuits Conference - (ISSCC),
Lee, Dong Uk ; Cho, Ho Sung ; Kim, Jihwan... - p. 334-336 , 2020
Link: https://doi.org/10.1109/..
 
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8

Properties of Conductive Oxygen Vacancies and Compact Model..:

, In: 2020 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD),
Park, Junsung ; Kim, Min-Jae ; Jang, Jae-Hyung. - p. 217-220 , 2020
Link: https://doi.org/10.23919..
 
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9

Disparity Refinement with Guided Filtering of Soft 3D Cost ..:

, In: 2019 International Conference on Image and Vision Computing New Zealand (IVCNZ),
Lee, Min-Jae ; Um, Gi-Mun ; Yun, Joungil.. - p. 1-5 , 2019
Link: https://doi.org/10.1109/..
 
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10

A Single-Supply Buffer-Embedding SAR ADC with Skip-Reset ha..:

, In: 2019 IEEE Asian Solid-State Circuits Conference (A-SSCC),
Seo, Min-Jae ; Jin, Dong-Hwan ; Kim, Ye-Dam... - p. 189-192 , 2019
Link: https://doi.org/10.1109/..
 
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11

Advanced half-duplex cooperative scheme for immersive signa..:

, In: Proceedings of the 3rd International Conference on Communication and Information Processing,
Shim, Seong-Joon ; Park, Sung-Soon ; Paek, Min-Jae. - p. 316-319 , 2017
Link: https://dl.acm.org/doi/1..
 
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12

XPRESS : a queriable compression for XML data:

, In: Proceedings of the 2003 ACM SIGMOD international conference on Management of data,
Min, Jun-Ki ; Park, Myung-Jae ; Chung, Chin-Wan - p. 122-133 , 2003
Link: https://dl.acm.org/doi/1..
 
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13

A C-based RTL design verification methodology for complex m..:

, In: Proceedings of the 34th annual Design Automation Conference,
Yim, Joon-Seo ; Hwang, Yoon-Ho ; Park, Chang-Jae... - p. 83-88 , 1997
Link: https://dl.acm.org/doi/1..
 
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14

Fabrication of Nanostructures on Optical Fibers Using Nanos..:

, In: 2023 IEEE SENSORS,
Kim, Hyeong-Min ; Nam, Young-Ho ; Yang, Seung-Chul.. - p. 1-4 , 2023
Link: https://doi.org/10.1109/..
 
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15

A Study on the Mechanical Debonding Process through Static-..:

, In: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC),
Lee, Hyeong-Gi ; Kim, Dae-Sung ; Cho, Jung-Hyun... - p. 303-308 , 2020
Link: https://doi.org/10.1109/..
 
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