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2022 IEEE 24th Electronics Packaging Technology Conference (EPTC) ,
1
Stress-Free Thin Die-Level De-bonding for 2.5D, 3DIC Packag..:
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Proceedings of the Sixth International Conference on Emerging Databases: Technologies, Applications, and Theory ,
2
A ballet posture education using IT techniques : a compa..:
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2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ,
4
Modeling of Spreading Behavior of UV-Curable Dielectric Ink..:
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2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC) ,
5
Direct Patterning of Conductive Fine Line in Dielectric Lay..:
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2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ,
6
Optimization of Cu interconnects - SiCN interfacial adhesio..:
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2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ,
7
Novel method for NCF flow simulation in HBM thermal compres..:
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2007 IEEE International Symposium on Consumer Electronics ,
8
Dynamic Sensing Level Selection for Energy Efficiency in Wi..:
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Advances in Computer Science and Ubiquitous Computing; Lecture Notes in Electrical Engineering ,
12
MetaOps: Metaverse Operations for Large-Scale Metaverse Ser..:
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Advances in Computer Science and Ubiquitous Computing; Lecture Notes in Electrical Engineering ,
13
Smarteria: Intelligent Cafeteria Using Multimodal Data:
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2022 IEEE International Solid- State Circuits Conference (ISSCC) ,
14