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Warpage Optimization of Package Substrates Using Metamodels..:

, In: 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE),

Porathur, Fredy John ; Kamble, Vikram G ; Stadler, Eduard... - p. 1-9 , 2024

Link: https://doi.org/10.1109/..

Numerical Modeling of Split-Set Friction Bolt:

, In: Springer Proceedings in Earth and Environmental Sciences; Proceedings of the 10th Asian Mining Congress 2023,

Samala, Sai Rohith ; Porathur, John Loui ; Giri, Ayan. - p. 254-263 , 2023

Link: https://doi.org/10.1007/..

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