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Qiao, Neng-Hu
39  Ergebnisse:
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1

Summary of the 2023 Low-Power Deep Learning Object Detectio..:

, In: 2023 IEEE International Conference on Multimedia and Expo Workshops (ICMEW),
Ni, Yu-Shu ; Tsai, Chia-Chi ; Chen, Chih-Cheng... - p. 34-39 , 2023
Link: https://doi.org/10.1109/..
 
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2

DiscoverPath: A Knowledge Refinement and Retrieval System f..:

, In: Proceedings of the 32nd ACM International Conference on Information and Knowledge Management,
Chuang, Yu-Neng ; Wang, Guanchu ; Chang, Chia-Yuan... - p. 5021-5025 , 2023
Link: https://dl.acm.org/doi/1..
 
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3

Reinforcement Learning for Crowd Control Optimization with ..:

, In: 2023 13th International Conference on Information Science and Technology (ICIST),
Liang, Shu-Rui ; Wei, Feng-Feng ; Hu, Xiao-Min. - p. 668-677 , 2023
Link: https://doi.org/10.1109/..
 
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4

CameraPose: Weakly-Supervised Monocular 3D Human Pose Estim..:

, In: 2023 IEEE/CVF Winter Conference on Applications of Computer Vision (WACV),
Yang, Cheng-Yen ; Luo, Jiajia ; Xia, Lu... - p. 2923-2932 , 2023
Link: https://doi.org/10.1109/..
 
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5

An Adaptive Cooperative Frequency Strategy in Distributed C..:

, In: 2023 13th International Conference on Information Science and Technology (ICIST),
Guo, Xiao-Qi ; Li, Ling-Yu ; Wei, Feng-Feng.. - p. 616-622 , 2023
Link: https://doi.org/10.1109/..
 
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6

Summary of the 2022 Low-Power Deep Learning Semantic Segmen..:

, In: 2022 IEEE International Conference on Multimedia and Expo Workshops (ICMEW),
Ni, Yu-Shu ; Tsai, Chia-Chi ; Chen, Chih-Cheng... - p. 1-6 , 2022
Link: https://doi.org/10.1109/..
 
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7

Room Temperature Cu-Cu Direct Bonding Using Wetting/Passiva..:

, In: 2022 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits),
Hong, Zhong-Jie ; Liu, Demin ; Hsieh, Shu-Ting... - p. 387-388 , 2022
Link: https://doi.org/10.1109/..
 
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8

A surrogate-assisted multi-objective evolutionary algorithm..:

, In: Proceedings of the Genetic and Evolutionary Computation Conference Companion,
Zha, Shi-Cheng ; Chen, Wei-Neng ; Qiu, Wen-Jin. - p. 774-777 , 2022
Link: https://dl.acm.org/doi/1..
 
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9

Investigation of Low Temperature Co-Co Direct Bonding and C..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Liu, Demin ; Mei, Kuan-Chun ; Hu, Han-Wen... - p. 187-193 , 2022
Link: https://doi.org/10.1109/..
 
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10

RF Characterization on Nb-based Superconducting Silicon Int..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Yang, Yu-Tao ; Ren, Haoxiang ; Chong, Su Kong... - p. 949-955 , 2022
Link: https://doi.org/10.1109/..
 
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11

A distributed particle swarm optimization algorithm for dis..:

, In: Proceedings of the Genetic and Evolutionary Computation Conference Companion,
Li, Zi-Xing ; Guo, Xiao-Qi ; Chen, Wei-Neng. - p. 260-263 , 2022
Link: https://dl.acm.org/doi/1..
 
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12

Advanced 2.5D Heterogeneous Integrated Platform Using Flexi..:

, In: 2021 IEEE 71st Electronic Components and Technology Conference (ECTC),
Ku, Shu-Yun ; Tsai, Yi-Chieh ; Chou, Tzu-Chieh... - p. 1020-1025 , 2021
Link: https://doi.org/10.1109/..
 
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13

Ge Single-Crystal-Island (Ge-SCI) Technique and BEOL Ge Fin..:

, In: 2021 IEEE International Electron Devices Meeting (IEDM),
Chung, Hao-Tung ; Shih, Bo-Jheng ; Yang, Chih-Chao... - p. 34.5.1-34.5.4 , 2021
Link: https://doi.org/10.1109/..
 
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14

An empirical study of cooperative frequency in distributed ..:

, In: Proceedings of the Genetic and Evolutionary Computation Conference Companion,
Li, Ling-Yu ; Ou, Wen-Jie ; Hu, Xiao-Min.. - p. 203-204 , 2021
Link: https://dl.acm.org/doi/1..
 
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15

Track without Appearance: Learn Box and Tracklet Embedding ..:

, In: 2021 IEEE/CVF International Conference on Computer Vision (ICCV),
Wang, Gaoang ; Gu, Renshu ; Liu, Zuozhu... - p. 9856-9866 , 2021
Link: https://doi.org/10.1109/..
 
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