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Rhee, Seung Yeon
17  Ergebnisse:
Buchkapitel (Online) X
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1

A compact high performance millimeter-wave microstrip patch..:

, In: 2019 8th Asia-Pacific Conference on Antennas and Propagation (APCAP),
Jeong, Min-Joo ; Bong, Hanul ; Abbas, Anees... - p. 256-257 , 2019
Link: https://doi.org/10.1109/..
 
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2

A Novel Grouping Mechanism for Performance Enhancement of S..:

, In: 2019 IEEE Global Communications Conference (GLOBECOM),
Lei, Xiaoying ; Rhee, Seung Hyong - p. 1-5 , 2019
Link: https://doi.org/10.1109/..
 
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3

An Adaptive Power Management Scheme for WLANs using Reinfor..:

, In: 2019 International Conference on Information and Communication Technology Convergence (ICTC),
Lim, Tae Hyun ; Rhee, Seung Hyong - p. 412-415 , 2019
Link: https://doi.org/10.1109/..
 
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4

Plant Structure Ontology (PSO)— A Morphological and Anatomi..:

, In: Anatomy Ontologies for Bioinformatics; Computational Biology,
Ilic, Katica ; Rhee, Seung Y. ; Kellogg, Elizabeth A.. - p. 27-42 ,
Link: https://doi.org/10.1007/..
 
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5

Collision Avoidance in IEEE 802.11 DCF using a Reinforcemen..:

, In: 2020 International Conference on Information and Communication Technology Convergence (ICTC),
Lee, Chang Kyu ; Hyong Rhee, Seung - p. 898-901 , 2020
Link: https://doi.org/10.1109/..
 
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6

Circular Economy of Municipal Solid Waste (MSW) in Korea:

, In: Circular Economy: Global Perspective,
Rhee, Seung-Whee - p. 317-332 , 2019
Link: https://doi.org/10.1007/..
 
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7

New Implementation Plan for Improvement of Waste Recycling ..:

, In: Sustainable Waste Management: Policies and Case Studies,
Choi, Hyeong-Jin ; Choi, Yong ; Rhee, Seung-Whee - p. 579-585 , 2019
Link: https://doi.org/10.1007/..
 
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8

Material Stream in the Recycling Process for Spent Compact ..:

, In: Waste Management and Resource Efficiency,
Rhee, Seung-Whee ; Choi, Hyeong-Jin - p. 81-90 , 2018
Link: https://doi.org/10.1007/..
 
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9

Shared Positive Affect in Workgroups:

, In: The Oxford handbook of positive organizational scholarship / Gretchen M. Spreitzer and Kim S. Cameron (editors)
Rhee, Seung-Yoon ; Yoon, Hye Jung. (2012) 
Link: https://doi.org/10.1093/..
 
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10

Copper contamination control in Hybrid Copper Bonding:

, In: 2023 International Conference on Electronics Packaging (ICEP),
Kim, Wooyoung ; Han, Seung Ho ; Lee, Yongin... - p. 41-42 , 2023
Link: https://doi.org/10.23919..
 
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11

Achieving Sub-nm Copper Recess Controllability for Advanced..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Hahn, Seung Ho ; Kim, Wooyoung ; Lim, Kyeongbin.. - p. 1322-1328 , 2024
Link: https://doi.org/10.1109/..
 
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12

A New Evaluation Method of Bonding Strength Using Atomic Fo..:

, In: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC),
Shin, Donggap ; Moon, Bumki ; Lee, Yongin... - p. 350-353 , 2023
Link: https://doi.org/10.1109/..
 
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13

Contamination-Free Cu/SiCN Hybrid Bonding Process Developme..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Hahn, Seung Ho ; Kim, Wooyoung ; Shin, Donggap... - p. 1390-1396 , 2023
Link: https://doi.org/10.1109/..
 
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14

Clustering Mobile Traffic Data with Autoencoder Using Time-..:

, In: 2023 14th International Conference on Information and Communication Technology Convergence (ICTC),
Lee, Sang-Yeon ; Yoo, Hyun-Min ; Rhee, Jong-Seok... - p. 1738-1741 , 2023
Link: https://doi.org/10.1109/..
 
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15

Molecular Dynamics Study on Plasma-Surface Interactions of ..:

, In: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC),
Hahn, Seung Ho ; Kim, Wooyoung ; Shin, Donggap... - p. 527-533 , 2022
Link: https://doi.org/10.1109/..
 
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