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RILEM Bookseries; Second RILEM International Conference on Earthen Construction ,
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First Findings on the Mechanical Analysis of Cob Using a Di..:
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2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC) ,
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LTCC as substrate - enabling semiconductor and packaging in..:
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RILEM Bookseries; Structural Analysis of Historical Constructions ,
3
External Post-tensioning System for the Strengthening of Hi..:
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2023 IEEE Nuclear Science Symposium, Medical Imaging Conference and International Symposium on Room-Temperature Semiconductor Detectors (NSS MIC RTSD) ,
4
Commissioning a cost-effective TB-PET with TOF and DOI: the..:
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Methodologies and Intelligent Systems for Technology Enhanced Learning, 13th International Conference; Lecture Notes in Networks and Systems ,
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Multiple-Choice Questions Difficulty Prediction with Neural..:
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2023 IEEE International Autumn Meeting on Power, Electronics and Computing (ROPEC) ,
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Impulse Neurons: Phasic Bursts and Tonic Bursts, To Generat..:
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2019 5th International Conference on Science in Information Technology (ICSITech) ,
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Comparative Performance Analysis Between Software-Defined N..:
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2019 5th International Conference on Science in Information Technology (ICSITech) ,
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Keynote Speakers--Comparative Performance Analysis Between ..:
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2022 IEEE International Symposium on Circuits and Systems (ISCAS) ,
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An MPSoC-based on-line Edge Infrastructure for Embedded Neu..:
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Analytical Sample Preparation With Nano- and Other High-Performance Materials ,
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List of contributors:
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Proceedings of the International Conference on Embedded Software Companion ,
14
A neuromorphic approach of the sound source localization ta..:
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Proceedings of the XX International Conference on Human Computer Interaction ,
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