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2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ,
1
A New Vibration Test Method for Automotive and Consumer Ele..:
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2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ,
2
New Methodology Assessment of Copper Trace and Solder Joint..:
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2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) ,
3
Reduction of empiricism in the solder joint reliability ass..:
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2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ,
4
Impact of Temperature Cycling Conditions on Board Level Vib..:
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2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ,
5
Copper Pillar Voids in a Flip Chip Package During High Temp..:
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2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ,
6
Solder Joint Fatigue Studies Subjected to Board-level Rando..:
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2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) ,
7
Semi-empirical law for fatigue resistance of redistribution..:
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2020 IEEE 70th Electronic Components and Technology Conference (ECTC) ,
8
Considerations on a Smart Strategy for Simultaneously Testi..:
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Sub-Seasonal to Seasonal Prediction ,
9
Predicting Climate Impacts on Health at Sub-seasonal to Sea..:
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2016 IEEE 66th Electronic Components and Technology Conference (ECTC) ,
11
Effect of Environmental and Testing Conditions on Board Lev..:
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2020 IEEE 70th Electronic Components and Technology Conference (ECTC) ,
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