Roucou, A.
12  Ergebnisse:
Personensuche X
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1

A New Vibration Test Method for Automotive and Consumer Ele..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Xie, Dongji ; Zhang, Andy ; Kelly, Brian... - p. 289-296 , 2023
 
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2

New Methodology Assessment of Copper Trace and Solder Joint..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Khaldarov, Valeriy ; Zhang, Andy ; Xie, Dongji... - p. 412-419 , 2023
 
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3

Reduction of empiricism in the solder joint reliability ass..:

, In: 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE),
 
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4

Impact of Temperature Cycling Conditions on Board Level Vib..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
 
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5

Copper Pillar Voids in a Flip Chip Package During High Temp..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Wang, Miao ; Mavinkurve, Amar ; Roucou, Romuald... - p. 852-857 , 2023
 
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6

Solder Joint Fatigue Studies Subjected to Board-level Rando..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Khaldarov, Valeriy ; Zhang, Andy ; Xie, Dongji... - p. 1777-1784 , 2022
 
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7

Semi-empirical law for fatigue resistance of redistribution..:

, In: 2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE),
 
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8

Considerations on a Smart Strategy for Simultaneously Testi..:

, In: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC),
Thukral, V. ; Roucou, R. ; Sauze, S.... - p. 793-800 , 2020
 
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10

Contributors:

, In: Sub-Seasonal to Seasonal Prediction,
Abhilash, S. ; Ahn, Min-Seop ; Baethgen, Walter E.... - p. ix-xii , 2019
 
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11

Effect of Environmental and Testing Conditions on Board Lev..:

, In: 2016 IEEE 66th Electronic Components and Technology Conference (ECTC),
Roucou, R. ; Zaal, J. J. M. ; Jalink, J... - p. 1105-1111 , 2016
 
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12

Empirical Model for the Degradation of IMC in SACQ Solder B..:

, In: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC),
 
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