Ryu, Seunggeol
2  Ergebnisse:
Personensuche X
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Assessment of Thermal-aware Floorplans in a 3D IC for Serve..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Jung, Ki Wook ; Cho, Eunho ; Jo, Sungeun... - p. 1036-1047 , 2022
 
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Effective Substrate Thermal Conductivity Modeling Method Ex..:

, In: 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm),
Hwang, Seungtae ; Lee, Bang weon ; Kim, Taehwan... - p. 244-248 , 2020
 
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