Personensuche
X
?
2024 International Conference on Electronics Packaging (ICEP) ,
1
Selective Cu Surface Activation for Cu-Sn Thermocompression..:
, In:
?
2023 International Conference on Electronics Packaging (ICEP) ,
2
Selective Cu Surface Activation for Cu-Sn Thermocompression..:
, In:
?
2020 IEEE 33rd International Conference on Micro Electro Mechanical Systems (MEMS) ,
4
Highly Deformable Optoelectronics Using Liquid Metal:
, In:
?
2024 IEEE Aerospace Conference ,
5
Development of an Ultra-small Mass Spectrometer for Future ..:
, In:
?
ICASSP 2024 - 2024 IEEE International Conference on Acoustics, Speech and Signal Processing (ICASSP) ,
6
Confidence-Aware Spatial-Temporal Attention Graph Convoluti..:
, In:
?
Sustained Simulation Performance 2022 ,
7
AOBA: The Most Powerful Vector Supercomputer in the World:
, In:
?
2024 IEEE 37th International Conference on Micro Electro Mechanical Systems (MEMS) ,
8
High Transmittance and High Diffraction Efficiency with SiN..:
, In:
?
2023 7th IEEE Electron Devices Technology & Manufacturing Conference (EDTM) ,
9
The Study of Dislocation Propagation in Si Wafer during IGB..:
, In:
?
Sensing Technology; Lecture Notes in Electrical Engineering ,
11
Development of a Loop Animated Full-Color Metasurface Holog..:
, In:
?
2023 IEEE International Magnetic Conference - Short Papers (INTERMAG Short Papers) ,
12
Challenge of Media Noise Suppression with Oxygen Control in..:
, In:
?
2023 IEEE 36th International Conference on Micro Electro Mechanical Systems (MEMS) ,
13
High Transmittance Metasurface Holograms Using Silicon Nitr..:
, In:
?
2023 International Conference on Consumer Electronics - Taiwan (ICCE-Taiwan) ,
15