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Shin, Ga-hee
8  Ergebnisse:
Buchkapitel (Online) X
Personensuche X
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1

Deep Learning Based Layout Recognition Approach for HMI Sof..:

, In: 2024 IEEE Conference on Artificial Intelligence (CAI),
Qun Pang, Ashton Xue ; Jansen Lin, Jiaxing ; Ong, Chin Hee... - p. 429-437 , 2024
Link: https://doi.org/10.1109/..
 
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2

Novel food processing technologies and regulatory hurdles:

, In: Ensuring Global Food Safety,
Barbosa-Cánovas, Gustavo V. ; Bermúdez-Aguirre, Daniela ; Gonçalves Franco, Beatriz.. - p. 221-228 , 2022
Link: https://doi.org/10.1016/..
 
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3

Highly Reliable 28nm Embedded Flash Process Development for..:

, In: 2021 IEEE International Memory Workshop (IMW),
Lee, Jaehun ; Jeong, Youngcheon ; Yeom, Kyongsik... - p. 1-3 , 2021
Link: https://doi.org/10.1109/..
 
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4

Reliability Analysis by Charge Migration of 3D SONOS Flash ..:

, In: 2020 IEEE International Reliability Physics Symposium (IRPS),
Jeong, Jun-Kyo ; Sung, Jae-Young ; Yang, Hee-Hun.. - p. 1-5 , 2020
Link: https://doi.org/10.1109/..
 
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5

Estimation of Process Performance Using Statistic Process C..:

, In: 2019 International Conference on Internet of Things (iThings) and IEEE Green Computing and Communications (GreenCom) and IEEE Cyber, Physical and Social Computing (CPSCom) and IEEE Smart Data (SmartData),
Pheng, Tola ; Ryu, Ga-Ae ; Kim, Rock-Won. - p. 1254-1256 , 2019
Link: https://doi.org/10.1109/..
 
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6

Novel Ni germanide technology with co-sputtering of Ni and ..:

, In: 2010 Silicon Nanoelectronics Workshop,
Kang, Min-Ho ; Oh, Se-Kyung ; Shin, Hong-Sik... - p. 1-2 , 2010
Link: https://doi.org/10.1109/..
 
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7

Reliability of Indium Solder Joints using a Laser-Assisted ..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Jung, Ji Eun ; Eom, Yong-Sung ; Joo, Jiho... - p. 2237-2243 , 2024
Link: https://doi.org/10.1109/..
 
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8

Epitaxial Strain Control of HfxZr1-xO2 with Sub-nm IGZO See..:

, In: 2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits),
Kim, Seongho ; Park, Young Keun ; Lee, Gyu Soup... - p. 1-2 , 2023
Link: https://doi.org/10.23919..
 
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