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Soh, Sharon
5  Ergebnisse:
Buchkapitel (Online) X
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1

Fan-Out Wafer Level Packaging Development Line:

, In: 2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC),
TC, Chai ; Ho, David ; SC, Chong... - p. 440-444 , 2020
Link: https://doi.org/10.1109/..
 
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2

Comprehensive study on effect of chip layout and mold thick..:

, In: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC),
Lim, Sharon Pei Siang ; Chong, Ser Choong ; Seit, Wen Wei... - p. 945-950 , 2022
Link: https://doi.org/10.1109/..
 
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3

Double Mold Antenna in Package for 77 GHz Automotive Radar:

, In: 2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC),
Ho, Soon Wee ; Boon, Soh Siew ; Long, Lau Boon... - p. 257-261 , 2020
Link: https://doi.org/10.1109/..
 
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4

Fan-Out Packaging with Thin-film Inductors:

, In: 2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC),
Boon, Soh Siew ; Wee, Ho Soon ; Boon, Simon Lim Siak... - p. 449-452 , 2020
Link: https://doi.org/10.1109/..
 
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5

Fine-Pitch RDL Integration for Fan-Out Wafer-Level Packagin:

, In: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC),
Lianto, Prayudi ; Tan, Chin Wei ; Jie Peng, Qi... - p. 1126-1131 , 2020
Link: https://doi.org/10.1109/..
 
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