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Son, Jae Hak
43  Ergebnisse:
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1

Wideband 3 dB quadrature microstrip line coupler with unequ..:

, In: 2015 IEEE 16th Annual Wireless and Microwave Technology Conference (WAMICON),
Kim, Hae Jin ; Wang, Son Jong ; Jung, Woo-Jae. - p. 1-4 , 2015
Link: https://doi.org/10.1109/..
 
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2

Low Height Wire bond Looping Technology using Wedge Bonding..:

, In: 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC),
Park, Ah-Young ; Lee, Jae Hak ; Kim, Seungman... - p. 169-174 , 2022
Link: https://doi.org/10.1109/..
 
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3

Development of a Next Generation Stretchable Substrate for ..:

, In: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC),
Park, Ah-Young ; Lee, Jae Hak ; Song, Jun-Yeob... - p. 36-39 , 2022
Link: https://doi.org/10.1109/..
 
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4

Hybrid Solder with silver hierarchical structure and partic..:

, In: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC),
Jeong, Hakyung ; Lee, Jae Hak ; Kim, Seung Man.. - p. 509-512 , 2022
Link: https://doi.org/10.1109/..
 
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5

Evaluation of Crack Propagation at the Interconnection Inte..:

, In: 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC),
Park, Ah-Young ; Lee, Jae Hak ; Song, Jun-Yeob.. - p. 99-102 , 2019
Link: https://doi.org/10.1109/..
 
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6

Study on the Embedded Flexible Hybrid Stack Package using P..:

, In: 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC),
Lee, Jae Hak ; Kim, Yong Jin ; Kim, Seung Man. - p. 1-5 , 2019
Link: https://doi.org/10.23919..
 
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7

Design and Analysis of Flexible Interconnects on an Extreme..:

, In: 2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC),
Jeong, Seungtaek ; Kim, Subin ; Kim, Youngwoo... - p. 387-390 , 2019
Link: https://doi.org/10.23919..
 
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8

Hybrid Current Mode Control for Phase-Shift Full-Bridge Con..:

, In: 2019 IEEE 4th International Future Energy Electronics Conference (IFEEC),
Ko, Jae - Hak ; Baek, Seung-Woo ; Kim, Hag-Won. - p. 1-6 , 2019
Link: https://doi.org/10.1109/..
 
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9

Contributors:

, In: Laboratory Animals,
Baamonde, Juan Manuel ; Baar, Michael ; Bayne, Kathryn... - p. xvii-xviii , 2014
Link: https://doi.org/10.1016/..
 
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10

Laws, Regulations, Guidelines, and Principles Pertaining to..:

, In: Laboratory Animals,
Miki-Kurosawa, Tsutomu ; Park, Jae Hak ; Hong, Chou-Chu - p. 267-294 , 2014
Link: https://doi.org/10.1016/..
 
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11

Study of intermetallic compound growth and failure mechanis..:

, In: 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC),
Jang, You Cheol ; Park, So Yeon ; Kim, Hyoung Dong... - p. 704-708 , 2014
Link: https://doi.org/10.1109/..
 
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12

Development of a 75 Coulomb triggered vacuum switch:

, In: Conference Record of the Twenty-Sixth International Power Modulator Symposium, 2004 and 2004 High-Voltage Workshop.,
Park, S.S. ; Heo, H. ; Nam, S.H.... - p. 599,600,601,602 , 2004
Link: https://doi.org/10.1109/..
 
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13

Experimental comparison of induction motor and IPMSM with i..:

, In: 2023 IEEE Energy Conversion Congress and Exposition (ECCE),
Kim, Tae-Kil ; Kim, Jae-Hak ; Kim, Jung-Hwi... - p. 4208-4215 , 2023
Link: https://doi.org/10.1109/..
 
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14

Terahertz In0.8 Ga0.2 As quantum-well HEMTs toward 6G appli..:

, In: 2022 International Electron Devices Meeting (IEDM),
Park, Wan-Soo ; Jo, Hyeon-Bhin ; Kim, Hyo-Jin... - p. 11.4.1-11.4.4 , 2022
Link: https://doi.org/10.1109/..
 
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15

On the universality of drain-induced-barrier-lowering in fi..:

, In: 2022 International Electron Devices Meeting (IEDM),
Choi, Su-Min ; Jo, Hyeon-Bhin ; Yun, Do-Young... - p. 8.3.1-8.3.4 , 2022
Link: https://doi.org/10.1109/..
 
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