Personensuche
X
?
2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) ,
1
High Thermal EMC Solution Applied in Thin FCCSP:
, In:
?
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ,
2
High Thermal Graphite TIM Solution Applied to Fan-Out Platf..:
, In:
?
2015 Symposium on VLSI Circuits (VLSI Circuits) ,
3
A 2.7mW/Channel 48-to-1000MHz Direct Sampling Full-Band Cab..:
, In:
?
2021 Opto-Electronics and Communications Conference (OECC) ,
5
Integrated Photonic Sources and Circuits in Lithium Niobate..:
, In:
?
2019 Compound Semiconductor Week (CSW) ,
6
Characterization of Si(111) surface nitridation on the prop..:
, In:
?
2023 7th IEEE Electron Devices Technology & Manufacturing Conference (EDTM) ,
7
Performance Evaluation of AFeRAM under Low Temperature Oper..:
, In:
?
2023 International VLSI Symposium on Technology, Systems and Applications (VLSI-TSA/VLSI-DAT) ,
8
NLS based Modeling of Temperature-dependent Phase Transitio..:
, In:
?
2022 International Electron Devices Meeting (IEDM) ,
9
Monte-Carlo Modeling and Characterization of Switching Dyna..:
, In:
?
2021 IEEE International Electron Devices Meeting (IEDM) ,
10
NLS based Modeling and Characterization of Switching Dynami..:
, In:
?
Proceedings of the 2016 International Symposium on Low Power Electronics and Design ,
11
Benchmarking of Monolayer and Bilayer Two-Dimensional Trans..:
, In:
?
2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits) ,
12
A CMOS/Microfluidics Point-of-Care SoC employing Square-Wav..:
, In:
?
RILEM Bookseries; Structural Analysis of Historical Constructions ,
15
Temporal Variation of Charring Depth of the Wood-Frame Wall..:
, In:
1-15
