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2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) ,
1
High Thermal EMC Solution Applied in Thin FCCSP:
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2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ,
2
High Thermal Graphite TIM Solution Applied to Fan-Out Platf..:
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2015 Symposium on VLSI Circuits (VLSI Circuits) ,
3
A 2.7mW/Channel 48-to-1000MHz Direct Sampling Full-Band Cab..:
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2021 Opto-Electronics and Communications Conference (OECC) ,
5
Integrated Photonic Sources and Circuits in Lithium Niobate..:
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2019 Compound Semiconductor Week (CSW) ,
6
Characterization of Si(111) surface nitridation on the prop..:
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2023 7th IEEE Electron Devices Technology & Manufacturing Conference (EDTM) ,
7
Performance Evaluation of AFeRAM under Low Temperature Oper..:
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2023 International VLSI Symposium on Technology, Systems and Applications (VLSI-TSA/VLSI-DAT) ,
8
NLS based Modeling of Temperature-dependent Phase Transitio..:
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2022 International Electron Devices Meeting (IEDM) ,
9
Monte-Carlo Modeling and Characterization of Switching Dyna..:
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2021 IEEE International Electron Devices Meeting (IEDM) ,
10
NLS based Modeling and Characterization of Switching Dynami..:
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Proceedings of the 2016 International Symposium on Low Power Electronics and Design ,
11
Benchmarking of Monolayer and Bilayer Two-Dimensional Trans..:
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2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits) ,
12
A CMOS/Microfluidics Point-of-Care SoC employing Square-Wav..:
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RILEM Bookseries; Structural Analysis of Historical Constructions ,
15