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Synthese Library; Methodological Prospects for Scientific Research ,
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Plurality of Explanatory Strategies in Biology: Mechanisms ..:
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Advances in Intelligent Systems and Computing; ICGG 2020 - Proceedings of the 19th International Conference on Geometry and Graphics ,
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Graphic Methodology Based on Funicular and Projective Geome..:
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Philosophy of Science; European Studies in Philosophy of Science ,
3
When Mechanisms Are Not Enough: The Origin of Eukaryotes an..:
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Advances in Intelligent Systems and Computing; ICGG 2018 - Proceedings of the 18th International Conference on Geometry and Graphics ,
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Graphical Analysis of the Structural Behavior, According Hy..:
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Lecture Notes on Data Engineering and Communications Technologies; ICGG 2022 - Proceedings of the 20th International Conference on Geometry and Graphics ,
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Graphic Methodology in Structural Analysis of Historical Co..:
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Companion Proceedings of The 2019 World Wide Web Conference ,
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Examining the Roles of Automation, Crowds and Professionals..:
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Advances in Intelligent Systems and Computing; Advances in Information and Communication Technologies for Adapting Agriculture to Climate Change II ,
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Silkworm Growth Monitoring in Second Stage -Instar- Using A..:
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Multi-level Finance and the Euro Crisis ,
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A tale of two cities: the Olympics in Barcelona and Turin:
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2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ,
9
Demonstration of a Wafer Level Face- To-Back (F2B) Fine Pit..:
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Advances in Artificial Intelligence - IBERAMIA 2018; Lecture Notes in Computer Science ,
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Design of a Computational Model for Organizational Learning..:
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2016 World Automation Congress (WAC) ,
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Intelligent control for the exciter of a synchronous machin..:
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2014 9th Computing Colombian Conference (9CCC) ,
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Pattern classification of brain tissues for navigation in t..:
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2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ,
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Low Resistance and High Isolation HD TSV for 3-Layer CMOS I..:
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2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ,
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3-layer Fine Pitch Cu-Cu Hybrid Bonding Demonstrator With H..:
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Communications in Computer and Information Science; Applied Computer Sciences in Engineering ,
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