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2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) ,
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Effects of Silicide Inclusion Shape on Thermal Transport of..:
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2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) ,
2
Wafer-Scale Hierarchically Textured Silicon for Surface Coo..:
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Earth Observation Open Science and Innovation ,
3
Mapping Floods and Assessing Flood Vulnerability for Disast..:
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Proceedings of the 22nd ACM Internet Measurement Conference ,
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Respect the ORIGIN! : a best-case evaluation of connecti..:
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2022 IEEE 34th International Conference on Microelectronic Test Structures (ICMTS) ,
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Test Structures for Characterising the Fabrication of Minia..:
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2022 IEEE 16th International Conference on Semantic Computing (ICSC) ,
10
Directional Pairwise Class Confusion Bias and Its Mitigatio:
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2022 IEEE 23rd International Conference on Information Reuse and Integration for Data Science (IRI) ,
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