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Ta-Cheng Chen
440  Ergebnisse:
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1

Immune-Based Algorithm for the Multi-server Home Care Servi..:

, In: Lecture Notes in Computer Science; Integrated Uncertainty in Knowledge Modelling and Decision Making,
Hsieh, Yi-Chih ; You, Peng-Sheng ; Chen, Ta-Cheng - p. 199-210 , 2023
Link: https://doi.org/10.1007/..
 
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2

Exploring the Application of Multi-Sensory Device Interacti..:

, In: ACM SIGGRAPH 2024 Posters,
Chen, Chin-Chun ; Yang, Tung-Hua ; Yang, Cheng-Ta... - p. 1-2 , 2024
Link: https://dl.acm.org/doi/1..
 
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3

Meta Flow Experience: Exploring Group Mindfulness Meditatio..:

, In: Adjunct Proceedings of the 2023 ACM International Joint Conference on Pervasive and Ubiquitous Computing & the 2023 ACM International Symposium on Wearable Computing,
Peng, Jih Hsuan ; Han, Ping-Hsuan ; Yang, Cheng-Ta... - p. 381-385 , 2023
Link: https://dl.acm.org/doi/1..
 
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4

A CMOS Concentration of Tea Polyphenols to Frequency Conver..:

, In: 2023 IEEE International Conference on Mechatronics and Automation (ICMA),
Chiang, Cheng-Ta ; Wu, Sheng-Min ; Huang, Zi-Xuan. - p. 398-402 , 2023
Link: https://doi.org/10.1109/..
 
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5

A CMOS Sulfur Dioxide Concentration to Time Period Converte..:

, In: 2023 IEEE International Conference on Mechatronics and Automation (ICMA),
Chiang, Cheng-Ta ; Wu, Yi-Cheng ; Yang, Shu-Huan. - p. 1763-1767 , 2023
Link: https://doi.org/10.1109/..
 
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6

Development of low-cost camera-based UAV control strategy:

, In: 2022 International Automatic Control Conference (CACS),
Jhan, Zih-Syuan ; Yeh, Nai-Jui ; Hsieh, Tzu-Ling.. - p. 1-6 , 2022
Link: https://doi.org/10.1109/..
 
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7

Characterization of Low Loss Dielectric Materials for High-..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Lee, Tzu Nien ; Lau, John H ; Ko, Cheng-Ta... - p. 2222-2229 , 2022
Link: https://doi.org/10.1109/..
 
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8

A CMOS Algae Growth Period to Duty Cycle Converter for Moni..:

, In: 2022 IEEE International Conference on Mechatronics and Automation (ICMA),
Chiang, Cheng-Ta ; Nien, Chun-Yao ; Yang, Min-Shun.. - p. 792-796 , 2022
Link: https://doi.org/10.1109/..
 
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9

DACNN: Dynamic Weighted Attention with Multi-channel Convol..:

, In: 2020 21st IEEE International Conference on Mobile Data Management (MDM),
Yang, Cheng-Ta ; Chen, Yi-Ling - p. 316-321 , 2020
Link: https://doi.org/10.1109/..
 
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10

A Rapid Deployment Indoor Positioning Architecture based on..:

, In: 2020 IEEE 7th International Conference on Industrial Engineering and Applications (ICIEA),
Wu, Jia-Hua ; Huang, Cheng-Ta ; Huang, Zhi-Ren.. - p. 784-789 , 2020
Link: https://doi.org/10.1109/..
 
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11

Fan-Out RDL-first Panel-Level Packaging for Heterogeneous I..:

, In: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC),
Lau, John H ; Ko, Cheng-Ta ; Yang, Kai-Ming... - p. 339-347 , 2020
Link: https://doi.org/10.1109/..
 
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12

A CMOS Capsaicin Concentration Converter with Auto-Sensitiv..:

, In: 2020 IEEE International Conference on Mechatronics and Automation (ICMA),
Chiang, Cheng-Ta ; Hsu, Fang-Chi ; Lin, Wen-Jie. - p. 536-541 , 2020
Link: https://doi.org/10.1109/..
 
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13

A CMOS Salinity Difference to Frequency Converter with Auto..:

, In: 2019 IEEE International Conference on Mechatronics and Automation (ICMA),
Chiang, Cheng-Ta ; Chen, Tsung-Yuan ; Wu, Yi-Ting - p. 637-642 , 2019
Link: https://doi.org/10.1109/..
 
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14

Non-Planarization Cu-Cu Direct Bonding and Gang Bonding wit..:

, In: 2019 IEEE International Electron Devices Meeting (IEDM),
Chou, Tzu-Chieh ; Yang, Kai-Ming ; Li, Jian-Chen... - p. 5.5.1-5.5.4 , 2019
Link: https://doi.org/10.1109/..
 
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15

Fan-Out Wafer-Level Packaging for Heterogeneous Integration:

, In: 2018 IEEE 68th Electronic Components and Technology Conference (ECTC),
Lau, John ; Li, Zhang ; Tan, Kim Hwee... - p. 2360-2366 , 2018
Link: https://doi.org/10.1109/..
 
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