Tang, Dao-Quan
52  Ergebnisse:
Personensuche X
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2

EV-FuseMODNet: Moving Object Detection Using the Fusion of ..:

, In: 2023 IEEE International Conference on Service Operations and Logistics, and Informatics (SOLI),
 
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3

Attention-based Proposals Refinement for 3D Object Detectio:

, In: 2022 IEEE Intelligent Vehicles Symposium (IV),
Dao, Minh-Quan ; Hery, Elwan ; Fremont, Vincent - p. 197-205 , 2022
 
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4

3D-FlowNet: Event-based optical flow estimation with 3D rep..:

, In: 2022 IEEE Intelligent Vehicles Symposium (IV),
Sun, Haixin ; Dao, Minh-Quan ; Fremont, Vincent - p. 1845-1850 , 2022
 
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5

Development of a Wearable Human Pulse Measuring Device usin..:

, In: 2023 International Conference on System Science and Engineering (ICSSE),
Thanh, Quan Dao ; Quoc, Tuan Le ; Ha, Duc Bui - p. 39-44 , 2023
 
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6

A study on cascade design for cpg-based controller of a pla..:

, In: 2017 IEEE Conference on Systems, Process and Control (ICSPC),
 
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7

Wavelet Diffusion Models are fast and scalable Image Genera..:

, In: 2023 IEEE/CVF Conference on Computer Vision and Pattern Recognition (CVPR),
Phung, Hao ; Dao, Quan ; Tran, Anh - p. 10199-10208 , 2023
 
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8

Anti-DreamBooth: Protecting users from personalized text-to..:

, In: 2023 IEEE/CVF International Conference on Computer Vision (ICCV),
Van Le, Thanh ; Phung, Hao ; Nguyen, Thuan Hoang... - p. 2116-2127 , 2023
 
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9

Modification of the Kohonen Algorithm for Diagnosing Printe..:

, In: 2022 XIX Technical Scientific Conference on Aviation Dedicated to the Memory of N.E. Zhukovsky (TSCZh),
 
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10

Application of Kohonen's Algorithm in Electrical Diagnostic..:

, In: 2022 Moscow Workshop on Electronic and Networking Technologies (MWENT),
 
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11

Investigation into the Impact of Layout Design on Thermal P..:

, In: 2024 International Conference on Electronics Packaging (ICEP),
Chen, Tang-Yuan ; Chen, Dao-Long ; Chiu, Frank.. - p. 249-250 , 2024
 
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12

Post-Buckling Analysis for Addressing Asymmetric Warping of..:

, In: 2023 International Conference on Electronics Packaging (ICEP),
Chen, Chia-Yu ; Lee, Yu-Ching ; Chen, Kuo-Shen... - p. 265-266 , 2023
 
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13

A Study of Underfill Dispensing Patterns in Flip-Chip Packa..:

, In: 2023 International Conference on Electronics Packaging (ICEP),
Chen, Dao-Long ; Chang, Hui-Jing ; Chen, Tang-Yuan... - p. 115-116 , 2023
 
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14

A Quantitative Evaluation of the Inelastic Energy Absorptio..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Wang, Chien-Yu ; Chiu, Tz-Cheng ; Yin, Wei-Jie... - p. 721-726 , 2023
 
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15

Reliability Prediction and Improvement of Board-Level Therm..:

, In: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC),
Chen, Dao-Long ; Chen, Tang-Yuan ; Lai, Wei-Hong... - p. 995-998 , 2023
 
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