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Tatsumi, Hiroshi
20  Ergebnisse:
Buchkapitel (Online) X
Personensuche X
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1

Performance analysis of the 802.11ax UL OFDMA random access..:

, In: 2017 IEEE International Conference on Communications (ICC),
Lanante, Leonardo ; Uwai, Hiroshi Ochi Tatsumi ; Nagao, Yuhei.. - p. 1-6 , 2017
Link: https://doi.org/10.1109/..
 
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2

Ag Sintered Joints on ENIG Cu Substrates by an Ag-Based Com..:

, In: 2024 International Conference on Electronics Packaging (ICEP),
Wang, Chuncheng ; Tatsumi, Hiroaki ; Nishikawa, Hiroshi - p. 95-96 , 2024
Link: https://doi.org/10.23919..
 
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3

Joint Strength of Transient Liquid Phase Bonding Using Cu-S..:

, In: 2024 International Conference on Electronics Packaging (ICEP),
Sakamoto, Ichizo ; Jeong, Doojin ; Tatsumi, Hiroaki. - p. 41-42 , 2024
Link: https://doi.org/10.23919..
 
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4

Low Thermal Resistance Joint Using Lotus-type Cu/Solder Com..:

, In: 2024 International Conference on Electronics Packaging (ICEP),
Tatsumi, Hiroaki ; Isono, Hiroshi ; Hirase, Kana.. - p. 51-52 , 2024
Link: https://doi.org/10.23919..
 
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5

Interfacial Intermetallic Compounds of Bi2Te3/Cu joint usin..:

, In: 2023 International Conference on Electronics Packaging (ICEP),
Pak, Seongwoo ; Tatsumi, Hiroaki ; Wang, Jianhao. - p. 199-200 , 2023
Link: https://doi.org/10.23919..
 
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6

Significant consumption of Ni-P layer in Ni-P/Sn-0.7Cu sold..:

, In: 2023 International Conference on Electronics Packaging (ICEP),
Oya, Satoshi ; Tatsumi, Hiroaki ; Nishikawa, Hiroshi - p. 81-82 , 2023
Link: https://doi.org/10.23919..
 
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7

Failure Analysis of Joints Bonded by Ag-In Transient Liquid..:

, In: 2023 International Conference on Electronics Packaging (ICEP),
Liu, Xunda ; Tatsumi, Hiroaki ; Jin, Zhi. - p. 25-26 , 2023
Link: https://doi.org/10.23919..
 
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8

Molecular Dynamics Simulation of Cu-Cu Solid-State Bonding ..:

, In: 2023 International Conference on Electronics Packaging (ICEP),
Tatsumi, Hiroaki ; Kao, C.R. ; Nishikawa, Hiroshi - p. 149-150 , 2023
Link: https://doi.org/10.23919..
 
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9

Microstructure and property of Ag sintered joint doping wit..:

, In: 2023 International Conference on Electronics Packaging (ICEP),
Wang, Jianhao ; Yodo, Shogo ; Tatsumi, Hiroaki. - p. 145-146 , 2023
Link: https://doi.org/10.23919..
 
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10

Contributors:

, In: Hayabusa2 Asteroid Sample Return Mission,
Abe, Masanao ; Arakawa, Masahiko ; Bellerose, Julie... - p. xi-xiii , 2022
Link: https://doi.org/10.1016/..
 
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11

Contributors:

, In: Autophagy in Health and Disease,
Abdellatif, Mahmoud ; Ahsan, Nuzhat ; Albornoz, Amelina... - p. xi-xiv , 2022
Link: https://doi.org/10.1016/..
 
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12

Effect of isothermal aging on properties of In-48Sn and In-..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Han, Duy Le ; Tatsumi, Hiroaki ; Huo, Fupeng. - p. 2148-2152 , 2022
Link: https://doi.org/10.1109/..
 
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13

Mechanical properties of transient liquid phase bonded join..:

, In: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC),
Liu, Xunda ; Jin, Zhi ; Tatsumi, Hiroaki. - p. 71-75 , 2022
Link: https://doi.org/10.1109/..
 
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14

New approach for EMC Assurance of Noise Propagation Effects..:

, In: 2020 International Symposium on Electromagnetic Compatibility - EMC EUROPE,
YAJIMA, Yuzo ; KINODA, Hiroshi ; AOKI, Toshihiko... - p. 1-5 , 2020
Link: https://doi.org/10.1109/..
 
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15

Producing Video Clips for Information Ethics and Security i..:

, In: Proceedings of the 2017 ACM SIGUCCS Annual Conference,
Wada, Tomohito ; Fuse, Izumi ; Okabe, Shigeto... - p. 129-131 , 2017
Link: https://dl.acm.org/doi/1..
 
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