Tran, Jasmine
4  Ergebnisse:
Personensuche X
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2

Cu Wirebond Technology in 16FFC High Performance Automotive..:

, In: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC),
Lim, Jasmine ; Tran, Tu-Anh ; Au, Y.K.. - p. 24-31 , 2022
 
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3

Package Design Characterization Influencing Substrate Metal..:

, In: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC),
Jasmine, Lim ; Tu-Anh, Tran ; Sandeep, S.. - p. 169-176 , 2023
 
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4

Interdisciplinary Support Teams to Enhance Social Emotional..:

, In: Handbook of Research on Interdisciplinary Preparation for Equitable Special Education; Advances in Educational Technologies and Instructional Design,
 
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