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X
Tseng, J.
1855  Ergebnisse:
Buchkapitel (Online) X
Personensuche X
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1

A microstrip in-line band rejection structure:

, In: 2016 Progress in Electromagnetic Research Symposium (PIERS),
Lin, H.-P. ; Lai, B.-T. ; Ku, C.-C... - p. 3442-3442 , 2016
Link: https://doi.org/10.1109/..
 
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2

A VFB tunable Single Metal Single Dielectric approach using..:

, In: 2009 International Symposium on VLSI Technology, Systems, and Applications,
Petry, J. ; Boccardi, G. ; Singanamalla, R.... - p. None , 2009
Link: https://doi.org/10.1109/..
 
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3

Oxygen Supplementation and Humidification:

, In: Textbook of Respiratory Disease in Dogs and Cats,
TSENG, L - p. 205-213 , 2004
Link: https://doi.org/10.1016/..
 
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4

A novel LCD driver testing technique using logic test chann..:

, In: Proceedings of the 2003 Asia and South Pacific Design Automation Conference,
Su, Chauchin ; Wang, Wei-Juo ; Wang, Chih-Hu. - p. 657-662 , 2003
Link: https://dl.acm.org/doi/1..
 
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5

Equivalent network representation for high efficiency corru..:

, In: 1973 Antennas and Propagation Society International Symposium,
Tseng, D. - p. 101,102,103,104 , 1973
Link: https://doi.org/10.1109/..
 
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6

Are Superpages Super-fast? Distilling Flash Blocks to Unify..:

, In: 2024 IEEE International Symposium on High-Performance Computer Architecture (HPCA),
Tseng, Shih-Hung ; Chen, Tseng-Yi ; Yang, Ming-Chang - p. 630-642 , 2024
Link: https://doi.org/10.1109/..
 
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7

BLDC Motor Zero-Speed Startup Position Sensorless FOC Contr..:

, In: 2024 IEEE 10th International Power Electronics and Motion Control Conference (IPEMC2024-ECCE Asia),
Wei Jian, Nicholas Chiang ; Cao, Shuyu ; Tseng, K. J... - p. 1282-1287 , 2024
Link: https://doi.org/10.1109/..
 
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8

Advanced Chip on Wafer Hybrid Bonding with Copper/Polymer B..:

, In: 2024 International VLSI Symposium on Technology, Systems and Applications (VLSI TSA),
Ouyang, Tsung- Yu ; Lin, Yu-Min ; Chan, Yu-Ping... - p. 1-2 , 2024
Link: https://doi.org/10.1109/..
 
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9

Brief Announcement: Racos: A Leaderless Erasure Coding Stat..:

, In: Proceedings of the 36th ACM Symposium on Parallelism in Algorithms and Architectures,
Zarnstorff, Jonathan ; Lebow, Lucas ; Remuck, Dillon.. - p. 379-381 , 2024
Link: https://dl.acm.org/doi/1..
 
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10

Design of Ka-Band Chip Antenna Based on Slot Antenna:

, In: 2024 26th International Conference on Advanced Communications Technology (ICACT),
Chung, Ming-An ; Chen, Kai-Xiang ; Tseng, Kuo-Chun - p. 01-04 , 2024
Link: https://doi.org/10.23919..
 
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11

Cu Nanoparticle Sintering by Electrical Current:

, In: 2024 International Conference on Electronics Packaging (ICEP),
Wu, Albert T. ; Sheng, Tzu-Hao ; Chao, Jui-Lin.. - p. 107-108 , 2024
Link: https://doi.org/10.23919..
 
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12

An Adaptive Transmission Strategy for Tiled 360-Degree VR V..:

, In: Proceedings of the 39th ACM/SIGAPP Symposium on Applied Computing,
Tseng, Hsueh-Wen ; Yang, Ting-Ting ; Yang, Yi - p. 1765-1773 , 2024
Link: https://dl.acm.org/doi/1..
 
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13

An Ultra-Lightweight Time Period CNN Based Model with AI Ac..:

, In: 2024 IEEE International Symposium on Circuits and Systems (ISCAS),
Lee, Shuenn-Yuh ; Tseng, Wei-Cheng ; Chen, Ju-Yi - p. 1-4 , 2024
Link: https://doi.org/10.1109/..
 
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14

Proceedings of the Workshop on 3D Geometry Generation for S..:

, In: 2024 IEEE/CVF Winter Conference on Applications of Computer Vision Workshops (WACVW),
De Chanlatte, Marissa Ramirez ; Colella, Phil ; Darrell, Trevor... - p. 762-766 , 2024
Link: https://doi.org/10.1109/..
 
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15

Ball Trajectory and Landing Point Prediction Model Based on..:

, In: Computer and Information Science and Engineering; Studies in Computational Intelligence,
Chen, Jiann-Liang ; Hsieh, Han-Chuan ; Chiang, Hung-Tse. - p. 105-118 , 2024
Link: https://doi.org/10.1007/..
 
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