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1

Demo: A Mobile Edge Computing-based Collision Avoidance Sys..:

, In: IEEE INFOCOM 2019 - IEEE Conference on Computer Communications Workshops (INFOCOM WKSHPS),
Vazquez-Gallego, F. ; Vilalta, R. ; Garcia, A.... - p. 904-905 , 2019
Link: https://doi.org/10.1109/..
 
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2

Cytokines in Systemic Lupus Erythematosus:

, In: Systemic Lupus Erythematosus,
Rus, Violeta ; Via, Charles S. - p. 109-120 , 2007
Link: https://doi.org/10.1016/..
 
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3

Investigation of Recycled Concrete Aggregates Permeability ..:

, In: 2023 IEEE 15th International Conference on Humanoid, Nanotechnology, Information Technology, Communication and Control, Environment, and Management (HNICEM),
Clemente, Stephen John C. ; Cuenco, John Michael C. ; Gilbas Earl, Jayson L... - p. 1-5 , 2023
Link: https://doi.org/10.1109/..
 
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4

To belong to places: sketches from six cumbessias villages:

, In: 2006 First International Symposium on Environment Identities and Mediterranean Area,
Barbara, Via S. ; Moreddu, Elena - p. None , 2006
Link: https://doi.org/10.1109/..
 
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5

Assessing innovative bulk (111) 3C-SiC epitaxial growth:

, In: 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE),
Calabretta, C. ; Scuderi, V. ; Bongiorno, C.... - p. 1-5 , 2024
Link: https://doi.org/10.1109/..
 
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6

Advanced strategies for high activation in ion implanted 4H..:

, In: 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE),
Calabretta, C. ; Pecora, A. ; Agati, M.... - p. 1-5 , 2024
Link: https://doi.org/10.1109/..
 
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7

Measuring Techniques for the Semiconductor's Parameters:

, In: Springer Handbook of Semiconductor Devices; Springer Handbooks,
Alberti, Alessandra ; Giannazzo, Filippo ; Via, Francesco La... - p. 117-168 , 2022
Link: https://doi.org/10.1007/..
 
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8

4H-SiC defects evolution by thermal processes:

, In: 2016 European Conference on Silicon Carbide & Related Materials (ECSCRM),
Piluso, N. ; Di Stefano, M. A. ; Lorenti, S.. - p. 1-1 , 2016
Link: https://doi.org/10.4028/..
 
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9

SiC Films and Coatings:

, In: Silicon Carbide Biotechnology,
Locke, C.W. ; Severino, A. ; La Via, F.... - p. 17-61 , 2012
Link: https://doi.org/10.1016/..
 
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10

Thermal stability of thin CoSi2 layers on polysilicon impla..:

, In: European Workshop Materials for Advanced Metallization,,
La Via, F. ; Aberti, A. ; Raineri, V... - p. 181,182,183 , 1997
Link: https://doi.org/10.1109/..
 
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11

EXAFS investigation of Co sites in CoSi2 film crown by ion ..:

, In: European Workshop Materials for Advanced Metallization,,
Terrasi, A. ; La Via, F. ; D'Acapito, F.. - p. 189,190 , 1997
Link: https://doi.org/10.1109/..
 
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12

Kinetics of the C49-C54 phase transition in TiSi2: new indi..:

, In: European Workshop Materials for Advanced Metallization,,
Grimaldi, M.G. ; La Via, F. ; Bocelli, S.... - p. 113,114,115 , 1997
Link: https://doi.org/10.1109/..
 
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13

Car Classification Based on Image Using Transfer Learning C..:

, In: 2022 IEEE 8th Information Technology International Seminar (ITIS),
Saputra, Wahyu S J ; Puspaningrum, Eva Yulia ; Syahputra, Wahyu Firman... - p. 324-327 , 2022
Link: https://doi.org/10.1109/..
 
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14

First Coupling of AC-LGAD Sensors to a Timepix3 Chip:

, In: 2022 IEEE Nuclear Science Symposium and Medical Imaging Conference (NSS/MIC),
Barone, G. ; Bergmann, B. ; Boye, D.... - p. 1-4 , 2022
Link: https://doi.org/10.1109/..
 
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15

A 2021 Review on Recent Advancements in Robotic-assisted Mi..:

, In: 2021 IEEE 13th International Conference on Humanoid, Nanotechnology, Information Technology, Communication and Control, Environment, and Management (HNICEM),
Noelle Marie, D ; Espiritu ; Balcita, Via Dominique G.... - p. 1-5 , 2021
Link: https://doi.org/10.1109/..
 
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