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Wang, Chih-yi
1177  Ergebnisse:
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1

MoCVAE: Movement Prediction by A Conditional Variational Au..:

, In: 2024 IEEE International Conference on Big Data and Smart Computing (BigComp),
Sung, Pei-Chieh ; Lai, Hsu-Chao ; Jhang, Guan-Yi... - p. 40-47 , 2024
Link: https://doi.org/10.1109/..
 
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2

U-MRAM PUF: A Novel Unipolar-MRAM for Power and Area Effici..:

, In: 2024 International VLSI Symposium on Technology, Systems and Applications (VLSI TSA),
Shih, Ching ; Hong, Ming-Chun ; Wang, Chih-Yao... - p. 1-2 , 2024
Link: https://doi.org/10.1109/..
 
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3

Integrated Design Ecosystem for Chiplets Heterogeneous Inte..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Cao, Lihong ; Wang, Chen-Chao ; Huang, Chih-Yi. - p. 1048-1053 , 2024
Link: https://doi.org/10.1109/..
 
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4

Creative Design and Structure Applied to Chiplets Packaging:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Wang, Chen-Chao ; Huang, Chih-Yi ; Kuo, Hung-Chun... - p. 1353-1358 , 2023
Link: https://doi.org/10.1109/..
 
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5

A Case Study of Detecting HULK-based DDoS Traffic with Rand..:

, In: 2023 International Conference on Consumer Electronics - Taiwan (ICCE-Taiwan),
Cai, Yi-Xian ; Chang, Tsu-Chen ; Wang, Chih-Chiang - p. 609-610 , 2023
Link: https://doi.org/10.1109/..
 
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6

U-MRAM: Transistor-Less, High-Speed (10 ns), Low-Voltage (0..:

, In: 2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits),
Wu, Ming-Hung ; Hong, Ming-Chun ; Shih, Ching... - p. 1-2 , 2023
Link: https://doi.org/10.23919..
 
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7

TreeXGNN: can gradient-boosted decision trees help boost he..:

, In: ICASSP 2023 - 2023 IEEE International Conference on Acoustics, Speech and Signal Processing (ICASSP),
Hong, Ming-Yi ; Chang, Shih-Yen ; Hsu, Hao-Wei... - p. 1-5 , 2023
Link: https://doi.org/10.1109/..
 
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8

Detecting Children with Autism Spectrum Disorder Based on E..:

, In: 2023 IEEE 6th International Conference on Knowledge Innovation and Invention (ICKII),
Lu, Hsin-Yi ; Lin, Yang-Cheng ; Chen, Chia-Hsin... - p. 372-375 , 2023
Link: https://doi.org/10.1109/..
 
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9

An Implementation of Feature Selection for Detecting LOIC-b..:

, In: 2023 International Conference on Consumer Electronics - Taiwan (ICCE-Taiwan),
Cai, Yi-Xian ; Chen, Shih-Chieh ; Wang, Chih-Chiang - p. 607-608 , 2023
Link: https://doi.org/10.1109/..
 
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10

Advanced Packaging Design Platform for Chiplets and Heterog..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Cao, Lihong ; Wang, Chen-Chao ; Huang, Chih-Yi. - p. 1032-1037 , 2023
Link: https://doi.org/10.1109/..
 
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11

Semiconductor Package Design Flow and Platform Applied on F..:

, In: 2023 International Conference on Electronics Packaging (ICEP),
Lin, Youle ; Chang, Keng-Tuan ; Kuo, Hung-Chun.. - p. 21-22 , 2023
Link: https://doi.org/10.23919..
 
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12

Structure and Performance Co-optimization for the Developme..:

, In: 2023 International VLSI Symposium on Technology, Systems and Applications (VLSI-TSA/VLSI-DAT),
Rahaman, Sk Ziaur ; Hsin, Yu-Chen ; Yang, Shan-Yi... - p. 1-2 , 2023
Link: https://doi.org/10.1109/..
 
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13

Sorting Of Extracellular Vesicles By Using Optically-Induce..:

, In: 2023 IEEE 36th International Conference on Micro Electro Mechanical Systems (MEMS),
Soong, Wei-Jen ; Wang, Chih-Hung ; Chen, Yi-Sin.. - p. 479-482 , 2023
Link: https://doi.org/10.1109/..
 
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14

Investigation on ESD Robustness of 1200-V D- Mode GaN MIS-H..:

, In: 2023 International VLSI Symposium on Technology, Systems and Applications (VLSI-TSA/VLSI-DAT),
Ke, Chao-Yang ; Wang, Wei-Cheng ; Ker, Ming-Dou.. - p. 1-2 , 2023
Link: https://doi.org/10.1109/..
 
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15

Deep Learning based Refinement for Package Substrate Routin:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Huang, Peng-Tai ; Koyama, Tsubasa ; Chang, Keng-Tuan... - p. 1871-1874 , 2023
Link: https://doi.org/10.1109/..
 
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