Personensuche
X
?
21st Century Maritime Silk Road: Wind Energy Resource Evaluation; Springer Oceanography ,
1
Research Status, Difficulties and Countermeasures of Offsho..:
, In:
?
21st Century Maritime Silk Road: Wind Energy Resource Evaluation; Springer Oceanography ,
2
Offshore Wind Energy Evaluation in the Sri Lankan Waters:
, In:
?
21st Century Maritime Silk Road: Wind Energy Resource Evaluation; Springer Oceanography ,
3
Climatic Temporal-Spatial Distribution of Offshore Wind Ene..:
, In:
?
21st Century Maritime Silk Road: Wind Energy Resource Evaluation; Springer Oceanography ,
4
Construction of Temporal-Spatial Characteristics Dataset of..:
, In:
?
21st Century Maritime Silk Road: Wind Energy Resource Evaluation; Springer Oceanography ,
5
An All-Elements Long-Term Projection of Offshore Wind Energ..:
, In:
?
21st Century Maritime Silk Road: Wind Energy Resource Evaluation; Springer Oceanography ,
6
An All-Elements Short-Term Forecasting of Offshore Wind Ene..:
, In:
?
21st Century Maritime Silk Road: Wind Energy Resource Evaluation; Springer Oceanography ,
7
Introduction:
, In:
?
21st Century Maritime Silk Road: Wind Energy Resource Evaluation; Springer Oceanography ,
8
Climatic Trend of Offshore Wind Energy in the Maritime Silk..:
, In:
?
2014 International Conference on Management Science & Engineering 21th Annual Conference Proceedings ,
9
Study on fund performance to various measures: Evidence fro..:
, In:
?
2008 International Symposium on Computer Science and Computational Technology ,
10
Deviation Problem and its Solving:
, In:
?
ASIC, 2003. Proceedings. 5th International Conference on ,
11
A 32-bit hybrid microprocessor design for multimedia applic..:
, In:
?
ASIC, 2003. Proceedings. 5th International Conference on ,
12
A design of regularized multiplier generator:
, In:
?
2023 24th International Conference on Electronic Packaging Technology (ICEPT) ,
13
Analysis of the Transformation Characteristics of Primary a..:
, In:
?
2022 23rd International Conference on Electronic Packaging Technology (ICEPT) ,
14
Research on ceramic package for high temperature electronic..:
, In:
?
Intelligence Science III; IFIP Advances in Information and Communication Technology ,
15