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Wang, Yun-Ping
2337  Ergebnisse:
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1

Damage Mechanisms of Tight Sandstone Reservoirs Induced by ..:

, In: Springer Series in Geomechanics and Geoengineering; Proceedings of the International Field Exploration and Development Conference 2023,
Teng, Ge-ge ; She, Ji-ping ; Zhang, Shi-yu... - p. 514-533 , 2024
Link: https://doi.org/10.1007/..
 
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2

Analysis and Optimization of Permanent Magnet-Assisted Sync..:

, In: 2023 26th International Conference on Electrical Machines and Systems (ICEMS),
Lu, Jin-Ping ; Wan, Wen-Jie ; Lan, Yu-Hua.. - p. 561-566 , 2023
Link: https://doi.org/10.1109/..
 
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3

Surgical Instruments of Cleft Lip and Palate:

, In: Atlas of Cleft Lip and Palate & Facial Deformity Surgery,
Wang, Wen-yang ; Huang, Yun-ping ; Yao, Jian-min - p. 51-54 , 2020
Link: https://doi.org/10.1007/..
 
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4

A Research on the Steganography Capacity of the Reed-Solomo..:

, In: 2007 International Conference on Computational Intelligence and Security Workshops (CISW 2007),
Liu, Cui-Qing ; Ping, Xi-Jian ; Wang, Yun-He - p. None , 2007
Link: https://doi.org/10.1109/..
 
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5

SHDC: A Method of Similarity Measurement Using Heat Kernel ..:

, In: Intelligent Computing Theories and Application; Lecture Notes in Computer Science,
Zhao, Jian-ping ; Wang, Hai-yun ; Zheng, Chun-Hou - p. 327-335 , 2021
Link: https://doi.org/10.1007/..
 
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6

A method of optimum product platform parameters planning:

, In: 2007 IEEE International Conference on Industrial Engineering and Engineering Management,
Zhao, Ling-xuan ; Jiang, Ping ; Wang, Xiao-yun.. - p. None , 2007
Link: https://doi.org/10.1109/..
 
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7

Case Study of SIMS Analysis on Insulators:

, In: 2023 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA),
Wang, Yun ; Ong, Kian Kok ; Teo, Han Wei... - p. 1-4 , 2023
Link: https://doi.org/10.1109/..
 
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8

Research on the input-output evaluation method of power gri..:

, In: 2022 4th International Academic Exchange Conference on Science and Technology Innovation (IAECST),
Zhang, Yuhong ; Yang, Jie ; Wang, Chao.. - p. 436-439 , 2022
Link: https://doi.org/10.1109/..
 
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9

Evaluation and Recognition of Fracturing Effect in Ultra-Lo..:

, In: Springer Series in Geomechanics and Geoengineering; Proceedings of the International Field Exploration and Development Conference 2023,
Wang, Wen-hong ; Guo, Si-qiang ; Cui, Yun-hua... - p. 773-784 , 2024
Link: https://doi.org/10.1007/..
 
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10

Contributors:

, In: Human Reproductive and Prenatal Genetics,
Aggarwal, Vimla ; Barber, T.M. ; Becker, Christian M.... - p. xiii-xix , 2023
Link: https://doi.org/10.1016/..
 
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11

Research on Operation State Evaluation of Power Plant Key T..:

, In: 2023 International Conference on Cyber-Physical Social Intelligence (ICCSI),
Yong-Ping, Gu ; Juan-Yun, Chen ; Xue-Wu, Wang... - p. 610-615 , 2023
Link: https://doi.org/10.1109/..
 
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12

Low Temperature Performance of LBE Oxygen Sensors with Diff..:

, In: Springer Proceedings in Physics; Proceedings of the 23rd Pacific Basin Nuclear Conference, Volume 3,
Qi, Mu-Ran ; Tang, Yun-Peng ; Zhu, Hui-Ping... - p. 508-518 , 2023
Link: https://doi.org/10.1007/..
 
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13

A combined simulation and experimental study on cracking an..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Chen, Bin ; Lyu, Guang-Chao ; Wang, Hong-Guang... - p. 2046-2053 , 2023
Link: https://doi.org/10.1109/..
 
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14

Large-area Die Attachment and the Surface Finish Effect on ..:

, In: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT),
Wang, Chun-Meng ; Hou, Bin ; Deng, Yun-Kai.. - p. 1-6 , 2022
Link: https://doi.org/10.1109/..
 
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15

Moisture Desorption and Hygro-Vapor-Thermal Induced Interfa..:

, In: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT),
Zheng, Long ; Deng, Yun-Kai ; Wang, Hong-Guang... - p. 1-5 , 2022
Link: https://doi.org/10.1109/..
 
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